Research and Development of Substrate Integrated Circuits and Systems for Gigahertz and Terahertz Electronics and Photonics
千兆赫和太赫兹电子和光子学衬底集成电路和系统的研究与开发
基本信息
- 批准号:122137-2012
- 负责人:
- 金额:$ 4.52万
- 依托单位:
- 依托单位国家:加拿大
- 项目类别:Discovery Grants Program - Individual
- 财政年份:2016
- 资助国家:加拿大
- 起止时间:2016-01-01 至 2017-12-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
The proposed research aims to investigate and explore an emerging and disruptive technology called "substrate integrated circuits (SICs)" towards the development of millimetre-wave and terahertz integrated circuits (MTICs). This concept of SICs was pioneered by the applicant over a decade ago. Substrate integrated waveguides (SIWs), which belong to the family of SICs, have been widely studied and successfully explored by researchers around the world, under the leadership of the applicant, for the development of a new generation microwave and millimetre-wave integrated circuits and systems. The fundamental feature of SICs is that almost all non-planar guided-wave structures can be synthesized and transformed into planar form at low cost, thereby making full integrations of such structures possible. Therefore, both planar and non-planar structures can be seamlessly integrated and made of the same processing techniques. This building platform holds the promise of becoming the next generation integrated circuits for millimetre-wave and terahertz systems and unifying the physical mechanisms of electronics and photonics. This research allows the applicant to continue leading international research efforts in discovering new circuit features, new design rules, new innovative devices, and new application areas. This will involve unconventional, multilayered substrates and mixed dielectric-metallic waveguides. Fundamental guided-wave properties will be investigated. Novel theoretical techniques will be studied and developed, and experimental prototypes will be made and demonstrated for antennas, circuits and systems. This project will foster substantial interests of this new technology for future millimetre-wave and terahertz system development towards complete hybrid and monolithic system-on-substrate integration and miniaturization. The applicant, his students and research associates are eager to make a comprehensive characterization and quick development of this revolutionary technology. This research is strategically important for future explorations and applications in the field of information and communication technology. It will allow the applicant to further expand one of the most visible Canadian research programs in the world.
拟议的研究旨在调查和探索一种称为“基板综合电路(SIC)”的新兴和破坏性技术,以开发毫米波和Terahertz综合电路(MTICS)。十年前,申请人率先提出了这个SIC的概念。属于SIC家族的底物集成波导(SIWS)已在申请人的领导下得到了全球研究人员的广泛研究和成功探索,以开发新一代的微波炉和毫米波整合电路和系统。 SICS的基本特征是,几乎所有非平面指导波结构都可以被低成本合成并转化为平面形式,从而使这些结构的完整整合成为可能。因此,平面和非平面结构都可以无缝整合并由相同的处理技术制成。该建筑平台有望成为毫米波和Terahertz系统的下一代集成电路,并统一电子和光子学的物理机制。这项研究使申请人能够继续领导国际研究工作,以发现新的电路功能,新的设计规则,新的创新设备和新的应用领域。这将涉及非常规的多层底物和混合介电 - 金属波导。将研究基本的指导波属性。将研究和开发新颖的理论技术,并将为天线,电路和系统制作实验原型。该项目将促进这项新技术的重大利益,以实现未来的毫米波和Terahertz系统开发,以实现完整的混合动力和单层系统内的整体整合和微型化。申请人,他的学生和研究伙伴渴望对这项革命性技术进行全面的特征和快速发展。这项研究对于在信息和通信技术领域的未来探索和应用在战略上很重要。它将允许申请人进一步扩大世界上最可见的加拿大研究计划之一。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Wu, Ke其他文献
QTL analysis of kernel shape and weight using recombinant inbred lines in wheat
- DOI:
10.1007/s10681-008-9794-2 - 发表时间:
2009-02-01 - 期刊:
- 影响因子:1.9
- 作者:
Sun, Xian-Yin;Wu, Ke;Li, Si-Shen - 通讯作者:
Li, Si-Shen
Degradation of Metal-Organic Framework Materials as Controlled-Release Fertilizers in Crop Fields
- DOI:
10.3390/polym11060947 - 发表时间:
2019-06-01 - 期刊:
- 影响因子:5
- 作者:
Wu, Ke;Du, Changwen;Zhou, Jianmin - 通讯作者:
Zhou, Jianmin
A Low-Cost Wideband 77-GHz Planar Butler Matrix in SIW Technology
- DOI:
10.1109/tap.2012.2207309 - 发表时间:
2012-10-01 - 期刊:
- 影响因子:5.7
- 作者:
Djerafi, Tarek;Wu, Ke - 通讯作者:
Wu, Ke
Super-compact substrate integrated waveguide cruciform directional coupler
- DOI:
10.1109/lmwc.2007.908040 - 发表时间:
2007-11-01 - 期刊:
- 影响因子:3
- 作者:
Djerafi, Tarek;Wu, Ke - 通讯作者:
Wu, Ke
Substrate Integrated Nonradiative Dielectric Waveguide Structures Directly Fabricated on Printed Circuit Boards and Metallized Dielectric Layers
直接在印刷电路板和金属化介电层上制造的基板集成非辐射介电波导结构
- DOI:
10.1109/tmtt.2011.2168969 - 发表时间:
2011-10 - 期刊:
- 影响因子:4.3
- 作者:
Xu, Feng;Wu, Ke - 通讯作者:
Wu, Ke
Wu, Ke的其他文献
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{{ truncateString('Wu, Ke', 18)}}的其他基金
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
- 批准号:
RGPIN-2017-06938 - 财政年份:2022
- 资助金额:
$ 4.52万 - 项目类别:
Discovery Grants Program - Individual
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
- 批准号:
RGPIN-2017-06938 - 财政年份:2021
- 资助金额:
$ 4.52万 - 项目类别:
Discovery Grants Program - Individual
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
- 批准号:
RGPIN-2017-06938 - 财政年份:2020
- 资助金额:
$ 4.52万 - 项目类别:
Discovery Grants Program - Individual
NSERC/Huawei industrial research chair in future wireless technologies
NSERC/华为未来无线技术工业研究主席
- 批准号:
492883-2015 - 财政年份:2020
- 资助金额:
$ 4.52万 - 项目类别:
Industrial Research Chairs
NSERC/Huawei industrial research chair in future wireless technologies
NSERC/华为未来无线技术工业研究主席
- 批准号:
492882-2015 - 财政年份:2019
- 资助金额:
$ 4.52万 - 项目类别:
Industrial Research Chairs
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
- 批准号:
RGPIN-2017-06938 - 财政年份:2019
- 资助金额:
$ 4.52万 - 项目类别:
Discovery Grants Program - Individual
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
- 批准号:
DGDND-2017-00003 - 财政年份:2019
- 资助金额:
$ 4.52万 - 项目类别:
DND/NSERC Discovery Grant Supplement
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
- 批准号:
DGDND-2017-00003 - 财政年份:2018
- 资助金额:
$ 4.52万 - 项目类别:
DND/NSERC Discovery Grant Supplement
Structural and Functional Integration of Wireless Transceiver over Megahertz through Terahertz
兆赫兹至太赫兹无线收发器的结构和功能集成
- 批准号:
RGPIN-2017-06938 - 财政年份:2018
- 资助金额:
$ 4.52万 - 项目类别:
Discovery Grants Program - Individual
NSERC/Huawei industrial research chair in future wireless technologies
NSERC/华为未来无线技术工业研究主席
- 批准号:
492883-2015 - 财政年份:2018
- 资助金额:
$ 4.52万 - 项目类别:
Industrial Research Chairs
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