ELECTROCHEMICAL MOULDING OF METALS THROUGH PROTEINS

通过蛋白质对金属进行电化学成型

• 批准号: 7369620
• 负责人: DANIEL SCHWARTZ
• 金额: $ 1.26万
• 依托单位: SCRIPPS RESEARCH INSTITUTE, THE
• 依托单位国家: 美国
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-08-01 至 2007-07-31
• 项目状态: 已结题
• 来源: https://reporter.nih.gov/project-details/7369620
• 关键词: ELECTROCHEMICAL; MOULDING; METALS; THROUGH; PROTEINS

This subproject is one of many research subprojects utilizing the resources provided by a Center grant funded by NIH/NCRR. The subproject and investigator (PI) may have received primary funding from another NIH source, and thus could be represented in other CRISP entries. The institution listed is for the Center, which is not necessarily the institution for the investigator. Correlation averaging of TEM tilt-series images is used to determine the 3D nanostructure of the inorganic p-type semiconductor cuprouos oxide electrodeposited through the pores of the hexagonally packed intermediate layer (HPI-layer) protein from Deinococcus radiodurans.

该子项目是利用NIH/NCRR资助的中心赠款提供的资源的许多研究子项目之一。子弹和调查员（PI）可能已经从其他NIH来源获得了主要资金，因此可以在其他清晰的条目中代表。列出的机构适用于该中心，这不一定是调查员的机构。使用TEM倾斜系列图像的相关平均图用于确定通过脱氧菌果蝇的六边形包装中间层（HPI-Layer）蛋白质的孔中的无机P型半导体半导体氧化物氧化物电沉积。