Ino-Flex: Enabling ultra-large area ultra-parallel roll-to-roll transfer printing of high performance flexible inorganic semiconductor devices

Ino-Flex：实现高性能柔性无机半导体器件的超大面积超并行卷对卷转印

• 批准号: EP/V051792/1
• 负责人: Richard Smith
• 金额: $ 32.23万
• 依托单位: University of Sheffield
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2021
• 资助国家: 英国
• 起止时间: 2021 至 无数据
• 项目状态: 未结题
• 来源: https://gtr.ukri.org/projects?ref=EP%2FV051792%2F1
• 关键词: Ino; Flex; Enabling; ultra; large

This project seeks to develop a new high volume manufacturing process that will enable high performance semiconductor devices to be integrated into a wide range of flexible products. This approach is based on transfer printing where ultra-thin semiconductor devices are removed from the original wafer and precisely transferred onto large scale flexible substrates. In order to significantly reduce the cost of fabricated products, this novel process allows for integration in to large scale roll-to-roll printing processes. A range of strategies including thermal and kinetic control mechanisms will be implemented within the new print system. This will allow for selective control of adhesion between the devices and the roller, enabling large numbers of semiconductor devices to be picked from their substrates in parallel by a roller and printed onto a continuously moving flexible rolled substrate. This process has the potential to be combined with well-established printing processes to allow high performance inorganic semiconductor devices to be integrated with other materials including organic semiconductors and fabrics. The use of high performance inorganic semiconductor materials that are usually mechanically inflexible due to their brittle wafer substrates, opens the door to a wide range of new and emerging smart technologies including high performance displays (both large scale and small scale for VR/AR), wearables, smart clothing and bio-technologies such as low cost health monitoring. Following the development of a prototype roll-to-roll transfer printing system, a range of devices will be integrated into flexible, large area substrates including optical and electronic components. These will be used to demonstrate the transformative potential of this manufacturing technique in a variety of new and emerging products.

该项目旨在开发一种新的大批量制造工艺，使高性能半导体器件能够集成到各种灵活的产品中。这种方法基于转移印刷，将超薄半导体器件从原始晶圆上移除并精确地转移到大规模柔性基板上。为了显着降低制造产品的成本，这种新颖的工艺可以集成到大规模卷对卷印刷工艺中。新的打印系统将实施一系列策略，包括热和动力学控制机制。这将允许选择性地控制器件和滚筒之间的粘附力，从而能够通过滚筒从其基板上平行拾取大量半导体器件，并将其印刷到连续移动的柔性卷状基板上。该工艺有可能与成熟的印刷工艺相结合，使高性能无机半导体器件能够与包括有机半导体和织物在内的其他材料集成。高性能无机半导体材料因其易碎的晶圆基板而通常在机械上不灵活，其使用为各种新兴智能技术打开了大门，包括高性能显示器（用于 VR/AR 的大型和小型显示器）、可穿戴设备、智能服装和低成本健康监测等生物技术。随着卷对卷转印系统原型的开发，一系列设备将被集成到柔性大面积基材中，包括光学和电子元件。这些将用于展示这种制造技术在各种新兴产品中的变革潜力。