A novel heat transfer enhancement method: Combination of Nano-encapsulated PCM and metal foam

一种新型传热强化方法：纳米封装相变材料与金属泡沫的组合

• 批准号: 22K03965
• 负责人: MOBEDI MOGHTADA
• 金额: $ 2.66万
• 依托单位: Shizuoka University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2022
• 资助国家: 日本
• 起止时间: 2022-04-01 至 2025-03-31
• 项目状态: 未结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-22K03965/
• 关键词: heat trans. enhancement; microfluidics; phase change material; non-encapsulated PCM; heat transfer; Enhancement

A wide literature review was done and many articles in this field was studied carefully. In order to solve the governing equations, two solvers were made in the COMSOL and OPENFOAM software. The governing equations were made dimensionless and the governing parameters were obtained. The effects of them on maximizing the heat transfer and minimization of pressure drop were investigated. The study was done for micro channels with rectangular cross-section. Many interesting results were found, and that’s why an abstract relating to the obtained results was sent to an international conference. An experimental device was designed and necessary equipment and materials such as microchannel, nano-encapsulated PCM etc. were ordered and received. Establishment of the experimental setup was started.

为了求解该控制方程，我们广泛查阅了文献，并仔细研究了该领域的许多文章，在COMSOL和OPENFOAM软件中对控制方程进行了无量纲化，并得到了它们的控制参数。研究人员对矩形横截面的微通道进行了研究，发现了许多有趣的结果，这就是与所获得的结果相关的摘要被发送给国际组织的原因。设计了实验装置，并订购并接收了微通道、纳米封装PCM等必要的设备和材料，开始建立实验装置。

项目成果

Enhancement of Heat Transfer in a Channel by Using Nano-Encapsulated Phase Change Material

使用纳米封装相变材料增强通道内的传热

• 发表时间: 2023
• 作者: 三上駿弥;石川 仁;近藤行成;仰木裕嗣;仰木裕嗣;M. Mobedi
• 通讯作者: M. Mobedi