Microstructure control of monotectic hybrid powders for developing multi-functional properties

用于开发多功能特性的偏晶杂化粉末的微观结构控制

• 批准号: 19360338
• 负责人: OHNUMA Ikuo
• 金额: $ 12.81万
• 依托单位: Tohoku University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2007
• 资助国家: 日本
• 起止时间: 2007 至 2009
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-19360338/
• 关键词: 状態図; 熱力学データベース; 液相2相分離; CALPHAD; 粉末; 電子材料; 熱力学デースベース

Miscibility gap in liquid phase in the Ag-Cu-X (X=Ni, Co, Fe) ternary systems was predicted and composition of the ternary alloys was optimized by thermodynamic calculation. Ingots were prepared by induction melting and powdered by gas-atomizing method. Consequently, each spherical particle of the powders exhibits egg-type microstructure, whose periphery and core consist of high-conductive Ag-rich phase and Cu-X phase, respectively. Obtained powders were sintered at 700～900℃ to form massive samples and their resistivity was measured to evaluate their potential for the high-conductive material. Resistivity of some sintered Ag-Cu-X alloys stacks up with a sintered pure Ag sample. It was found that Ag-rich phase decomposed from Cu-X core of particles as well as Ag-rich periphery forms dense and continuous network of the Ag-rich matrix, which results in the decrease of resistivity of sintered materials.

通过热力学计算，预测了Ag-Cu-X（X=Ni、Co、Fe）三元体系的液相混溶间隙，优化了三元合金的成分，采用感应熔炼法制备铸锭，并采用气雾化法制粉。经检测，粉末的每个球形颗粒均呈现鸡蛋型微观结构，其外围和核心分别由高导电富Ag相和Cu-X相组成。在700-900℃下烧结形成块状样品，并测量其电阻率，以评估某些烧结Ag-Cu-X合金的电阻率与烧结纯Ag样品的电阻率。 -由Cu-X颗粒核心和富Ag外围分解的富相形成致密且连续的富Ag基体网络，导致烧结体电阻率降低材料。

项目成果

Experimental investigation and thermodynamic calculation in the Ag-Bi-Ni and Cu-Bi-Ni systems

• DOI: 10.1557/jmr.2009.0302
• 发表时间: 2009-08
• 期刊: Journal of Materials Research
• 影响因子: 2.7
• 作者: F. Gao;Cuiping Wang;Xingjun Liu;Y. Takaku;I. Ohnuma;K. Ishida

Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap

• DOI: 10.1007/s11664-008-0537-x
• 发表时间: 2009-01-01
• 期刊: JOURNAL OF ELECTRONIC MATERIALS
• 影响因子: 2.1
• 作者: Ohnuma, I.;Saegusa, T.;Ishida, K.
• 通讯作者: Ishida, K.

Development of Thermodynamic Database for Cu-base Alloy Systems and Micro-Solders

铜基合金系统和微焊料热力学数据库的开发

• 发表时间: 2009
• 作者: I.Ohnuma;C.P. Wang;X.J.Liu;K.Ishida
• 通讯作者: K.Ishida

偏晶型Ag基合金粉末の相平衡と焼結体の電気抵抗特性

单晶银基合金粉末的相平衡及烧结体的电阻性能

• 发表时间: 2008
• 作者: 高久佳和;三枝拓朗;大森俊洋;大沼郁雄;貝沼亮介;石田清仁
• 通讯作者: 石田清仁

Thermodynamic assessment of phase equilibria in the Sn-Au-Bi system with key experimental verification

Sn-Au-Bi 体系中相平衡的热力学评估及关键实验验证

• DOI: 10.1557/jmr.2010.0056
• 发表时间: 2010-03
• 期刊: Journal of Materials Research
• 影响因子: 2.7
• 作者: Kiyohito Ishida;X.J. Liu;F. Gao;C.P. Wang;Yoshikazu Takaku;Ikuo Ohnuma
• 通讯作者: Ikuo Ohnuma