Production of nano-composite by electrochemical process in new solvent

新溶剂电化学法制备纳米复合材料

基本信息

批准号：
16360374
负责人：
AWAKURA Yasuhiro
金额：
$ 9.86万
依托单位：
KYOTO UNIVERSITY
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
2004
资助国家：
日本
起止时间：
2004 至 2006
项目状态：
已结题

项目摘要

In this study, we used TMHA-Tf_2N which is a new solvent for electrochemistry, but whose properties has not known well. Thus it is quite important issue to collect basic properties of this new solvent, for example, water content and kinematic viscosity, electrical conductivity were measured. As the results, kinematic viscosity of TMHA-Tf_2N was found to decrease with temperature and water content. On the other hand, the electrical conductivity increased with temperature and water content. As one of method to electroplate Cu-Sn alloy, we carried out electroreduction of Sn on Cu substrate and allowed mutual diffusion to form Cu-Sn alloy. To achieve this method, the diffusion coefficient has to be large. Thus, TMHA-Tf_2N has advantage because it is stable higher temperature than about 100 C, and at the higher temperature, the diffusion coefficient is high. As the results, (1) It was found that tin ion(II) was reduced to metallic tin at a higher voltage than natural voltage of tin electrode by cyclic voltammogram in the higher voltage range than 0 V. (2) Contact galvanic deposition was employed in ionic liquid. Obtained Cu-Sn alloy showed metallic white silver color. The composition of the alloy was Cu_6Sn_5, Cu_3Sn, Cu_<10>Sn_3 It is noted that the rate of film formation was three times larger at 150C than that at 90 C in aqueous solution. This implies the promising properties of this ionic liquid for a higher temperature electroplating method. (3) In potentiostatic electrolysis on Cu substrate, what intermetallic compound formed depends on applied voltage. At voltage lower than +40 mV, metallic wihite slver was obtained but higher than +50mV only black film was obtained. (4) We also applied the galvanic contact method to thin cupper film.

在本研究中，我们使用TMHA-Tf_2N，它是一种新型电化学溶剂，但其性能尚不清楚。因此，收集这种新溶剂的基本性质，例如测量水含量和运动粘度、电导率是非常重要的问题。结果发现，TMHA-Tf_2N 的运动粘度随着温度和含水量的增加而降低。另一方面，电导率随着温度和水含量的增加而增加。作为电镀Cu-Sn合金的方法之一，我们在Cu基体上进行Sn的电解还原，并使其相互扩散形成Cu-Sn合金。为了实现这种方法，扩散系数必须很大。因此，TMHA-Tf_2N具有优势，因为它在高于约100℃的温度下是稳定的，并且在较高温度下，扩散系数较高。结果，（1）通过循环伏安图，在高于0 V的电压范围内，发现锡离子（II）在高于锡电极自然电压的电压下被还原为金属锡。（2）接触电沉积用于离子液体。所得Cu-Sn合金呈金属白银色。合金的组成为Cu_6Sn_5、Cu_3Sn、Cu_10Sn_3。注意到，在水溶液中，150℃下的成膜速率是90℃下的成膜速率的三倍。这意味着这种离子液体在高温电镀方法中具有良好的性能。 (3)在Cu基体上进行恒电位电解时，所形成的金属间化合物取决于所施加的电压。当电压低于+40mV时，得到金属白银，而高于+50mV时，仅得到黑色薄膜。 (4)我们还将电接触法应用于铜薄膜。

项目成果

期刊论文数量（13）

专著数量（0）

科研奖励数量（0）

会议论文数量（0）

专利数量（0）

Water content and related physical properties of aliphatic quaternary ammonium imide-type ionic liquid containing metal ions

DOI：
10.1016/j.stam.2006.02.017
发表时间：
2006-09-01
期刊：
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
影响因子：
5.5
作者：
Katase, Takuma;Imashuku, Susumu;Awakura, Yasuhiro
通讯作者：
Awakura, Yasuhiro

Formation of Cu-Sn Alloy Layer by Contact Deposition Using Quaternary Ammonium Imide Type Ionic Liquid

使用季铵酰亚胺型离子液体通过接触沉积形成Cu-Sn合金层

DOI：
发表时间：
2006
期刊：
Electrochem. Solid-State Lett. 9
影响因子：
0
作者：
T.Katase;et al.;K.Murase et al.;T.Katase et al.;T.Katase et al.;T.Katase et al.
通讯作者：
T.Katase et al.

Electrochemical Alloying of Cupper Substrate with Tin Using Ionic Liquid as an Electrolyte at Medium-Low Temperatures

中低温下离子液体为电解质对铜基体与锡进行电化学合金化