Synthesis of Super-Hard Nano-Composite Films by High Density Plsama Sputtering

高密度等离子体溅射合成超硬纳米复合薄膜

基本信息

  • 批准号:
    13305053
  • 负责人:
  • 金额:
    $ 35.03万
  • 依托单位:
  • 依托单位国家:
    日本
  • 项目类别:
    Grant-in-Aid for Scientific Research (A)
  • 财政年份:
    2001
  • 资助国家:
    日本
  • 起止时间:
    2001 至 2003
  • 项目状态:
    已结题

项目摘要

1. The hardness of Ti-Cu-N nanocomposite films increased significantly from a value of about 22.8GPa for pure TiN films with the addition of a small amount of Cu, attained a maximum value of 42GPa at about 2 at.% Cu. The hardest Ti-Cu-N film was characterized as having nc-TiN/nc-Cu (not nc-TiN/a-Cu) nanocomposite structure, in which very tiny Cu crystallites (much smaller than TiN crystallites) dispersed between the nanocolumns of TiN crystallites. The biaxial compressive stress of the series of films was relatively low (<1.5GPa). Therefore, it was clarified that the superhardness of the hard/soft type of nanocomposite, which consists of a hard phase and a soft metal phase, does originate from a nanocomposite effect other than a high compressive stress2. The hardness of Ti-Si-N nanocomposite films increased significantly with the addition of a small amount of Si, reached a maximum value of 48GPa at about 5.8 at.% Si. The superhard Ti-Si-N films were characterized as having an nc-TiN/a-Si_3N_4 nanocomposite structures with a pronounced TiN(200) texture, where a-Si_3N_4 was assumed to segregate between nanocolumns of TiN crystallites. The hardening by the addition of Si was attributed to a nanocomposite effect. A simple theoretical calculation revealed
1。Ti-Cu-N纳米复合膜的硬度从纯锡膜的约22.8GPA的值显着增加,并添加了少量CU,最大值为42GPA,约为2个cu。最难的Ti-Cu-N膜的特征是具有NC-TIN/NC-CU(不是NC-TIN/A-CU)纳米复合材料结构,其中在Tin Crystallites的纳米颜色之间分散了非常微小的Cu Crystallites(比锡晶油小得多)。一系列薄膜的双轴压应力相对较低(<1.5GPA)。因此,可以澄清的是,由硬相位和软金属相组成的硬/软类型的纳米复合材料的超硬性确实来自纳米复合效应,而不是高压缩应力2。随着少量Si的添加,Ti-Si-N纳米复合膜的硬度显着增加,达到48GPA的最大值,约为5.8 at。%Si。 Superhard Ti-Si-N膜的特征是具有NC-TIN/A-SI_3N_4纳米复合材料结构,具有明显的TIN(200)纹理,其中A-SI_3N_4被假定在Tin Crystallites的纳米colloct中分类。通过添加Si的硬化归因于纳米复合效应。一个简单的理论计算显示

项目成果

期刊论文数量(34)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Preparation of superhard nanocomposite films by ICP assisted magnetron sputtering
ICP辅助磁控溅射制备超硬纳米复合薄膜
Z.G.Li, M.Mori, S.Miyake, M.Kumagai, T.Saito, Y.Muramatsu: "Structure and Properties of TiSiN Films Prepared by ICP Assisted Magnetron Sputtering with Low Energy Ion Bombatdment"The 4^<th> Asia-European International Conference on Plasma Surface Engineeri
Z.G.Li、M.Mori、S.Miyake、M.Kumagai、T.Saito、Y.Muramatsu:“ICP辅助磁控溅射低能离子轰击制备TiSiN薄膜的结构和性能”第4届亚洲-
  • DOI:
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    0
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  • 通讯作者:
J.L.He, Y.Setsuhara, I.Shimizu, S.Miyake: "Structure refinement and hardness enhancement of titanium nitride films by addition of copper"Surface and Coating Technology. 137. 38-42 (2001)
J.L.He、Y.Setsuhara、I.Shimizu、S.Miyake:“通过添加铜来细化氮化钛薄膜的结构并增强硬度”表面和涂层技术。
  • DOI:
  • 发表时间:
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    0
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Structure refinement and hardness enhancement of titanium nitride addition of copper
氮化钛加铜的组织细化和硬度增强
  • DOI:
  • 发表时间:
    2001
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Z.G.Li;Z.G.Li;Z.G.Li;S.Miyake;Z.G.Li;Z.G.Li;Z.G.Li;Z.G.Li;Z.G.LI;Z.G.Li;Z.G.Li;Z.G.Li;Z.G.LI;Z.G.Li;Z.G.Li;Z.G.LI;J.L.He;J.L.He
  • 通讯作者:
    J.L.He
Z.G.Li, S.Miyake, T.Tsumura: "Simulation of Nanoindentation Into Hard Thin Film on Soft Substrate"J.of High Temperature Society of Japan. 29. 152 (2003)
Z.G.Li、S.Miyake、T.Tsumura:“软基板上硬薄膜的纳米压痕模拟”日本高温学会杂志。
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SHOJI Miyake其他文献

SHOJI Miyake的其他文献

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