Research on Deformation Control Constitutive Model for Lead Free Electronic Devices

无铅电子器件变形控制本构模型研究

• 批准号: 12650067
• 负责人: SASAKI Katsuhiko
• 金额: $ 0.77万
• 依托单位: HOKKAIDO UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 2000
• 资助国家: 日本
• 起止时间: 2000 至 2001
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-12650067/
• 关键词: Electronic Device; Lead Free Solder Alloys; Time Dependent Deformation; Temperature Dependence; Constitutive Modeling; Plastic Deforamtion; Creep Deforamtion; Stress Relaxation; 温度依存性

In this research, for lead free electronic devices, construction of a constitutive model to control deformation of lead free solder alloys was conducted referring to basic tests such as pure tension, creep and stress relaxation. Moreover, a structural analysis using the constitutive model was proposed for the read free electronic devices, and reliability evaluation and structural optimization were carried out. The outlines of the research are as follows :1. Clarification of mechanical and fatigue life characteristic of lead free solder alloys : Basic characteristic of macroscopic mechanical behavior and fatigue failure were observed using the small specimens, which have the diameter of 8mm and are made of 60Sn/40Pb and Sn-3.5Ag-0.75Cu. The tests results showed the characteristic macroscopic inelastic deformation and fatigue life of lead free and lead solder alloys.2. Construction of constitutive model for solder alloys : Considering the results (1) constitutive models adapted to explain the inelastic deformation of lead solder alloys such as 60Sn/40Pb can not used to explain the inelastic deformation of lead free solder alloys, because the viscoplastic deformation of lead solder alloys is much different from that of lead free solder alloys. Then, construction of a new constitutive model to exactly explain the inelastic deformation of the lead free solder alloys was discussed. Since the solder alloys for connecting electronic devices is a few hundreds micro millimeter the internal structural change in solder alloys should be taken into account in the constitutive model. Therefore, the constitutive model based on dislocation density is employed in this research.3. Construction of structural analysis method using the constitutive model: Structural analysis was conducted by incorporate the model into a general purposed program of FEM. The advantage of the constitutive model based on dislocation density was verified.

在这项研究中，对于无铅电子设备，进行了构造模型来控制铅无焊料合金的变形，指的是基本测试，例如纯张力，蠕变和应力放松。此外，提出了使用本构模型进行的结构分析，以用于无读取电子设备，并进行了可靠性评估和结构优化。研究的轮廓如下：1。使用小样品的直径为8mm，由60sn/40pb和SN-3.5AG-0.75CU制成，阐明了无铅焊料合金的机械和疲劳寿命特征：宏观机械行为和疲劳失败的基本特征。 。测试结果表明，巨型非弹性变形和铅无铅和铅焊合金的疲劳寿命。2。构建焊料合金的本构模型：考虑结果（1）构成模型，用于解释诸如60sn/40pb之类的铅焊料合金的非弹性变形，无法用来解释铅含量的无弹性焊料合金的无弹性变形，因为铅焊合金与无铅焊料合金的合金大不相同。然后，讨论了一个新的构造模型的构建，以准确解释铅无弹性焊料合金的非弹性变形。由于用于连接电子设备的焊料合金是几百毫米，因此应在本构模型中考虑焊料合金的内部结构变化。因此，在这项研究中采用了基于位错密度的组成模型3。使用本构模型的结构分析方法的构建：结构分析是通过将模型纳入FEM的一般计划来进行的。验证了基于位错密度的本构模型的优势。

项目成果

K.Sasaki: "Viscoplastic Deformation of 40Pb/60Sn Solder Alloys-Experiments and Constitutive Modeling"Transactions of ASME, Journal of Electronic Packaging. 123・4. 379-387 (2001)

K.Sasaki：“40Pb/60Sn 焊料合金的粘塑性变形 - 实验和本构建模”，ASME 期刊，电子封装杂志 123・4 (2001)。

佐々木 克彦: "転位密度を考慮した構成モデルによる二軸ラチェット変形シミュレーション"日本機械学会論文集A編. 68・665. (2002)

Katsuhiko Sasaki：“使用考虑位错密度的本构模型进行双轴棘轮变形模拟”，日本机械工程师学会汇刊，A 版，68, 665。（2002 年）

K.Sasaki: "Viscoplastic deformation of Sn-3.5Ag-0.75Cu Solder Alloys"Material Science Research International, Special Technical Publication. 2. 397-402 (2001)

K.Sasaki：“Sn-3.5Ag-0.75Cu 焊料合金的粘塑性变形”国际材料科学研究特别技术出版物。

K. Sasaki, K. Ohguchi, H. Ishikawa: "Viscoplastic Deformation of 40Pb/60Sn Solder Alloys-Experiments and Constitutive Modeling"Transactions of ASME, Journal of Electronic Packaging. 123-4. 379-387 (2001)

K. Sasaki、K. Ohguchi、H. Ishikawa：“40Pb/60Sn 焊料合金的粘塑性变形 - 实验和本构建模”ASME 汇刊，电子封装杂志。

K.Ohguchi: "Description of Temperature Dependence and Creep Deformation of 60Sn-40Pb Solder Alloys"JSME International Journal Series A. 44・1. 82-88 (2001)

K. Ohguchi：“60Sn-40Pb 焊料合金的温度依赖性和蠕变变形的描述”JSME 国际期刊系列 A. 82-88 (2001)。