Development of Directionally Aligned SiC Whisker Grinding Wheel

定向排列碳化硅晶须砂轮的研制

• 批准号: 08455074
• 负责人: YAMAGUCHI Katusmi
• 金额: $ 5.57万
• 依托单位: Nagoya University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 1996
• 资助国家: 日本
• 起止时间: 1996 至 1997
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-08455074/
• 关键词: SiC whisker; Directional alignment; Grinding wheel; Grinding ratio; Lapping; Sistered diamond; Tool wear; Fatigue wear; 砥石; ウィスカ-; 研磨; SiC; 表面あらさ; 研削比; 目づまり; 研磨液

Grinding wheel made of the directionally aligned SiC whiskers was produced and its grinding characteristics were examined.Grinding characteristics of the resinoid, vitrified, metal and glass bonded wheels were tested and it was clarified that the resinoid wheel showed the best performance in the surface finish. Next, the authors succeeded in developing a loading free-grinding method in which free grains were mixed with grinding fluid, and overcoming a weak point of SiC whisker wheel. Futhermore, these wheel was applied to the lapping process, and very smooth surfaces of the hardened die steel and Si wafer were obtained.In addition to these experiments, tool wear were investigated in cutting the resinoid wheel. As the results, the effect of whisker size, shape and orientation on the tool wear were made clear and new model of wear mechanism due to fatigue was proposed.

生产了由方向排列的SIC晶须制成的磨轮，并检查了其研磨特性。测试了Resinoid，玻璃化，金属和玻璃粘合轮的磨损特性，并澄清了Resinoid Wheel在表面表面上表现出最佳性能。接下来，作者成功地开发了一种加载自由磨碎的方法，其中自由谷物与研磨流体混合在一起，并克服了SIC晶须轮的弱点。 futhermore，将这些车轮应用于收获过程，并获得了硬化钢和Si晶片的非常光滑的表面。除了这些实验外，还研究了工具磨损以切割树脂轮。结果，晶须尺寸，形状和方向对工具磨损的影响清晰，并提出了由于疲劳而引起的新的磨损机构模型。

项目成果

I.Horaguchi: "Surface Finishing Process using Directionally Aligned SiC Whisker Lap (in Japanese)" Journal of Society of Gringing Engineers. Vol.41.No.11. 428-433 (1997)

I.Horaguchi：“使用定向对齐 SiC 晶须研磨的表面精加工工艺（日语）”《磨削工程师学会杂志》。

JED.Afaghani: "Teat-off Wear Mechanism of Sintered Diamond Tool in Cutting SiC Particle StrengthendEpoxy Composite" Wear. 206. 221-229 (1997)

JED.Afaghani：“烧结金刚石刀具在切割 SiC 颗粒强化环氧复合材料时的咬断磨损机制”磨损。

山口勝美: "方位配列炭化ケイ素ウィスカ-砥石の研磨特性" ニューセラミックス. 11. 7-11 (1997)

Katsumi Yamaguchi：“方位角排列的碳化硅晶须 - 砂轮的抛光性能”《新陶瓷》11. 7-11 (1997)。

I.Horaguchi: "Surface Finishing Process using Directionally Aligned SiC Whisker Lap" ICPE '97TAIPE,TAIWAN Int.Conf.on Precision Engineering. 437-442 (1997)

I.Horaguchi：“使用定向对齐 SiC 晶须研磨的表面精加工工艺” ICPE 97TAIPE，台湾精密工程国际会议。

K.Yamaguchi: "Grinding with Directionally Aligned SiC Whisker Wheel (Loading-Free Grinding)" American Society for Precision Engineering 12th Annual Meeting. Vol.16. 258-261 (1997)

K.Yamaguchi：“用定向排列的 SiC 晶须轮进行磨削（无负载磨削）”美国精密工程学会第 12 届年会。