Transien Liquid Phase Bonding of Aluminum Alloy-Based Composites Using Thin Film as Insert Metal

使用薄膜作为插入金属的铝合金基复合材料的瞬态液相键合

• 批准号: 07650830
• 负责人: MOMONO Tadashi
• 金额: $ 1.41万
• 依托单位: Muroran Institute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (C)
• 财政年份: 1995
• 资助国家: 日本
• 起止时间: 1995 至 1996
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07650830/
• 关键词: TLP bonding; Insert metal; Diffusion Bonding; Composite; Isothermal solidification; Segregation

I.Transient Liquid Phase Bonding of Al_2O_3 Particle Reinforced A6061 Alloy-Based Composites Using Copper Thin Film as Insert Metal1.Copper thin film was oputimal for the insert metal of TLP bonding of the aluminum alloy based composites.2.Maximum Mechanical properties of joints were obtaind by the following conditions : Cu foil thickness of 0.5-3.0mum, bonding temperature 570ﾟC,bonding time of 0.3ks, and pressure of 1.0MPa.3.The joint of composites bonded with Cu thin film has been almost the same as the base metal in point of the tensile strength.4.Tensile strength of the joint were increased by T6 heat treatment after bonding.5.The segregation of Al_2O_3 particles at the bobd interface were prevented by using thin Cu film.II.Transient Liquid Phase Bonding of SiC Particle Reinforced AC3A Alloy-Based Composite to AC3A Using Copper Thin Film as Insert Metal1.Maximum mechanical properties of joints were obtaind by the following conditions : Cu foil thickness of 3.0mum, bonding temperature 560ﾟC,bonding time of 0.6ks, and pressure of 19.6MPa.2.Coase Si particles were segregated at the bond interface result from coexisting of Al-Cu eutectic liquid phase.

I.Transient Liquid Phase Bonding of Al_2O_3 Particle Reinforced A6061 Alloy-Based Composites Using Copper Thin Film as Insert Metal1.Copper thin film was optimal for the insert metal of TLP bonding of the aluminum alloy based compositions.2.Maximum Mechanical properties of joints were found by the following conditions: Cu foil thickness of 0.5-3.0mum, bonding temperature 570ﾟC, bonding time 0.3K的压力为1.0MPa。3。与Cu薄膜键合成的关节几乎与抗张强度的层金属几乎相同。4。粘合后T6热处理的连接强度增加。5。在使用BOBD粒子的Al_2o_3粒子的分离后，使用了bobd shipery pieluction actiency actiency actien.aii aIN.AL_2O_3颗粒的分离。 Alloy-Based Composite to AC3A Using Copper Thin Film as Insert Metal1.Maximum mechanical properties of joints were found by the following conditions: Cu foil thickness of 3.0mum, bonding temperature 560ﾟC, bonding time of 0.6ks, and pressure of 19.6MPa.2.Coase Si particles were segregated at the bond interface result from coexisting of Al-Cu eutectic liquid phase.

项目成果

桃野 正: "アルミニウムのTLP接合" 軽金属溶接. 33. 367-372 (1995)

Tadashi Momono：“铝的 TLP 连接”轻金属焊接 33. 367-372 (1995)。

Tadashi Momono: "Transient Liquid phase Bonding of Alminum Alloys" JOURNAL OF LIGHT METAL WELDING & CONSTRUCTION. VOL.33-NO.8. 367-372 (1995)

Tadashi Momono：“铝合金的瞬态液相结合”轻金属焊接杂志

桃野正: "アルミニウムのTLP接合" 軽金属溶接. 33. 367-372 (1995)

Tadashi Momono：“铝的 TLP 连接”轻金属焊接 33. 367-372 (1995)。