Widening of the joined interface by the procedure without heating and pressing

通过不加热、不加压的工序扩大接合界面

• 批准号: 07305058
• 负责人: ONZAWA Tadao
• 金额: $ 4.99万
• 依托单位: Tokyo Institute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (A)
• 财政年份: 1995
• 资助国家: 日本
• 起止时间: 1995 至 1996
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07305058/
• 关键词: adhesion; atomic force microscope; ultra high vacuum; molecular dynamics; chemical bond; interface; electronic spectroscopy; surface analysis; 無加圧; 接合; 拡散

A manipulating system is newly introduced to our adhesion force measurement system constructed in ultra high vacuum chamber of an Auger electron microscope. It has a heating system and an additive tilt freedom. The reconstruction of surface structure, the smoothing of the surface and the in-situ observation of the surface by secondary electron microscope during the adhesion force measurements. Results are compared with our theory which is deduced assuming the elastic continuum. The effects of the ion sputtering on the adhesion force and the governing mechanism of the adhesional contact are examined and discussed by using the theory. Criterion of surface roughness for perfect contact is deduced by K.Takahashi. The results qualitatively agree with the experimental results by T.Suga. The quantitative investigation is expected. The enhancing effects of interfacial diffusion during the joining is theoretically and experimentally discussed by Y.Takahashi. Damaging by ion sputtering is discussed by R.Shimizu. It is suggested that the effect of ion sputtering is mainly due to enhancement of the surface deformation rather than surface energy change. The limit of surface analysis is discussed by T.Sekine. Controlling of the surface roughness is investigated by K.Seimiya.

我们在俄歇电子显微镜的超高真空室中构建的粘附力测量系统新引入了操纵系统。它具有加热系统和附加倾斜自由度。粘附力测量过程中表面结构的重建、表面的平滑以及二次电镜对表面的原位观察。结果与我们假设弹性连续体推导出的理论进行了比较。运用理论检验和讨论了离子溅射对粘附力的影响以及粘附接触的控制机制。完美接触的表面粗糙度标准是由 K.Takahashi 推导出来的。结果与 T.Suga 的实验结果定性一致。预计将进行定量调查。 Y.Takahashi 从理论上和实验上讨论了连接过程中界面扩散的增强效应。 R.Shimizu 讨论了离子溅射造成的损坏。这表明离子溅射的效果主要是由于表面形变的增强而不是表面能的变化。 T.Sekine 讨论了表面分析的局限性。 K.Seimiya 研究了表面粗糙度的控制。