Creation of Nano-device/CMOS Merged Three Dimensional Integrated Circuits Using Shape-Functionalized Micro-interconnect

使用形状功能化微互连创建纳米器件/CMOS 合并三维集成电路

• 批准号: 21246061
• 负责人: ASANO Tanemasa
• 金额: $ 30.37万
• 依托单位: Kyushu University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (A)
• 财政年份: 2009
• 资助国家: 日本
• 起止时间: 2009 至 2012
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-21246061/
• 关键词: 電子デバイス・集積回路; インターコネクト・パッケージのシステム化応用; センシングデバイス; 三次元集積回路; 3D-LSI; インターコネクト; マイクロ接合; 常温接合; プリンティッドエレクトロニクス; フレキシブルエレクトロニクス; 超音波接合; クロコン酸; バンプ; 先鋭バンプ; ヘテロ集積

Bonding mechanism of cone-shaped microbump electrode, which was invented by the leader of this project research, has been investigated. Application of the mechanism to development of three dimensional integration of semiconductor circuits has also been investigated. This project achieved room temperature bonding of high density micro interconnect, which was not able to carry out using existing technology. The developed technology has been applied to integration of heterogeneous integration on silicon. As anexample, a high-resolution near infrared image sensor has been fabricated using the developed technology.

该项目研究领导者发明的锥形微气象电极的粘结机制已进行了研究。还研究了该机制在半导体电路的三维整合发展中的应用。该项目实现了高密度微互连的室温键合，该连接无法使用现有技术进行。已开发的技术已应用于硅上异质整合的整合。作为示例，已经使用已开发的技术制造了红外图像传感器附近的高分辨率。

项目成果

Room-Temperature Microjoining of LSI Chips on Poly(ethylene naphthalate) Film Using Mechanical Caulking of Au Cone Bump

使用金锥体凸点机械填缝将 LSI 芯片室温微接合在聚萘二甲酸乙二醇酯薄膜上

• DOI: 10.1143/jjap.51.04db04
• 发表时间: 2012
• 期刊: Jpn. J. Appl. Phys
• 作者: T. Shuto;N. Watanabe;A. Ikeda;and T. Asano
• 通讯作者: and T. Asano

Investigation of Enhanced Impact Ionization in Uniaxially Strained Si n-Channel Metal Oxide Semiconductor Field Effect Transistor

• DOI: 10.1143/jjap.49.04dc14
• 发表时间: 2010-04
• 期刊: Japanese Journal of Applied Physics
• 影响因子: 1.5
• 作者: S. Adachi;T. Asano

Room Temperature Microjoining of qVGA Class Area-Bump Array Using Cone Bump

使用锥形凸块的 qVGA 级区域凸块阵列的室温微连接

• 发表时间: 2012
• 作者: T. Shuto;K. Iwanabe;L. Qiu;and T. Asano
• 通讯作者: and T. Asano

Selective Heating of Microbumps Using Microwave for Low Strain Heterogeneous Chip Stack Integration

使用微波选择性加热微凸块以实现低应变异质芯片堆栈集成

• 发表时间: 2011
• 期刊: Extended Abstracts of the 2011 International Conference on Solid State Devices and Materials
• 作者: L.Qiu;T.Asano
• 通讯作者: T.Asano

A Liquid-Phase Bonding for High Density Chip-Stack Interconnection

用于高密度芯片堆叠互连的液相键合

• 发表时间: 2010
• 期刊: Proceedings of the 2010 International Meeting for Future of Electron Devices, Kansai
• 作者: L.Qiu;N.Watanabe;T.Asano
• 通讯作者: T.Asano