Studies on composite- and assemble-processes of metal and semiconductor clusters and their nanostructures

金属和半导体团簇及其纳米结构的复合和组装过程研究

• 批准号: 20246110
• 负责人: SUMIYAMA Kenji
• 金额: $ 29.29万
• 依托单位: Nagoya Institute of Technology
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (A)
• 财政年份: 2008
• 资助国家: 日本
• 起止时间: 2008 至 2010
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-20246110/
• 关键词: ナノプロヤス; ナノ粒子複合化; ナノ粒子高密度化; ナノプロセス; ナノ尺度計測; ナノ粒子界面制御; 表面ステンレス化; エキシトン型超伝導; ナノ粒子界面制

A new slow scan CCD camera was installed in the transmission electron microscope to improve the resolution of cluster images and a pulse micro-plasma cluster source was introduced to prepare several kinds of clusters. We studied characteristics of contact interfaces between different metal clusters and their effects on magnetic, electric, and catalytic properties. We also observed excellent magnetic properties in dense cluster assembled films, etc. These basic results are very useful to obtain highly functional cluster assembled materials.

在透射电子显微镜中安装新型慢扫描CCD相机以提高团簇图像的分辨率，并引入脉冲微等离子体团簇源来制备多种团簇。我们研究了不同金属簇之间的接触界面特征及其对磁、电和催化性能的影响。我们还在致密团簇组装薄膜等中观察到了优异的磁性能。这些基本结果对于获得高功能团簇组装材料非常有用。

项目成果

Vertically aligned carbon nanotubes from natural precursors by spray pyrolysis method and their field electron emission properties

• DOI: 10.1007/s00339-008-4856-9
• 发表时间: 2009
• 期刊: Applied Physics A
• 作者: P. Ghosh;T. Soga;M. Tanemura;M. Zamri;T. Jimbo;R. Katoh;K. Sumiyama

希薄磁性半導体In_2O_3薄膜の作製と磁気特性の評価

稀磁半导体In_2O_3薄膜的制备及磁性能评价

• 发表时间: 2010
• 作者: 宮脇ちよ美;日原岳彦
• 通讯作者: 日原岳彦

Exciton-type Superconductivity of Si-coated Sit Clusters Fabricated by a Plasma-Gas- Condensation

等离子体气体凝聚法制备的硅涂层坐团簇的激子型超导性

• 发表时间: 2011
• 作者: 黒川雄一郎;日原岳彦;隅山兼治
• 通讯作者: 隅山兼治

AgInS_2 Chalcopyrite Nanoparticles Prepared by Thermal Decomposition of Metal Complexes

金属配合物热分解制备AgInS_2黄铜矿纳米粒子

• 发表时间: 2008
• 作者: T. Ogawa;T. Kuzuya;K. Sumiyama;Y. Hamanaka
• 通讯作者: Y. Hamanaka

Ferromagnetism in Cu-Doped AIN films

掺铜 AIN 薄膜中的铁磁性

• 发表时间: 2009
• 期刊: Appl.Phys.Lett. 95
• 作者: Fan-Yong Ran;M.Subramanian;M.Tanemura;Y.Hayashi;T.Hihara
• 通讯作者: T.Hihara