Detection of aging of power electronic modules through the evaluation of the magnetic field pattern

通过评估磁场模式来检测电力电子模块的老化

• 批准号: 423760882
• 负责人: Professor Dr.-Ing. Gerd Griepentrog
• 金额: --
• 依托单位: Fachgebiet Leistungselektronik
• 依托单位国家: 德国
• 项目类别: Research Grants
• 财政年份: 2019
• 资助国家: 德国
• 起止时间: 2018-12-31 至 2021-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/423760882?language=en
• 关键词: Detection; aging; power; electronic; modules

Aging of power semiconductor modules is one of the key factor for expected lifetime and reliability of power electronics systems such as wind power converter, electrified vehicles, rolling stock and industrial drives. Especially for safety relevant and mobile application it is highly recommended to detect the state of health (SOH) and to schedule maintenance according to the SOH in order to avoid unexpected failures and system shut down.According to the state of the art the detection of fatigue of power electronic and more in particular its packaging and joining elements uses an estimate of the junction temperature based upon temperatures sensitive parameters and the total power losses and the thermal impedance. If there is a mismatch between both estimated values this is assumed to be a result of an increased thermal impedance due to cracks within the chip solder or delamination. The new method is based on the assumption that with propagating cracks in the chip solder or disconnected bond wires the current distribution within the chip and the DCB will change and therefore the spatial distribution of the magnetic field will change as well. Therefore, magnetic field sensors have to be installed as close as possible to the chips. With this method, the fatigue of the joints could be detected more directly in situ during operation and it does not require to intervene the power module. Within the project, the correlation between fatigue and the change of the magnetic field pattern has to be investigated. Furthermore, placement of magnetic field sensor, real time data processing and compensation of unwanted effects such as external magnetic fields are major challenges in order to receive reliable results even under challenging EMI conditions during operation.

电力半导体模块的老化是预期寿命和电力电子系统可靠性的关键因素之一，例如风电转换器，电动车辆，滚动库存和工业驱动器。特别是对于安全相关和移动应用，强烈建议检测健康状况（SOH）并根据SOH安排维护，以避免出乎意料的故障和系统关闭。遵守功率电子的疲劳检测，在包装的疲劳中检测到其包装和连接元素的估计范围基于温度损失的估计，并基于敏感范围的估计量，并具有敏感的敏感性和总体范围。如果两个估计值之间存在不匹配，则假定这是由于芯片焊料内部裂纹或分层裂纹而导致的热阻抗增加的结果。新方法基于以下假设：随着芯片焊料中的传播裂纹或断开的键线，芯片内的电流分布和DCB会发生变化，因此磁场的空间分布也会改变。因此，必须将磁场传感器安装到芯片上。使用这种方法，可以在操作过程中更直接地检测到关节的疲劳，并且不需要干预功率模块。在项目中，必须研究疲劳与磁场模式的变化之间的相关性。此外，磁场传感器的放置，实时数据处理和不需要效应（例如外部磁场）的补偿是主要的挑战，即使在操作过程中，即使在挑战性的EMI条件下，也要获得可靠的结果。