Shear lag analysis of dynamically loaded smart patch/substrate structures with interface defects

具有界面缺陷的动态加载智能贴片/基底结构的剪切滞后分析

• 批准号: 385584145
• 负责人: Professor Dr.-Ing. Wilfried Becker
• 金额: --
• 依托单位: Fachgebiet Strukturmechanik
• 依托单位国家: 德国
• 项目类别: Research Grants
• 财政年份: 2017
• 资助国家: 德国
• 起止时间: 2016-12-31 至 2017-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/385584145?language=en
• 关键词: Shear; lag; analysis; dynamically; loaded

The research objectives can be summarized as follows:1. To obtain the simple coupled system of ordinary differential equations for the dynamic time harmonic behaviour of a smart hygropiezothermal patch/layer structure with preliminary given location of an interface void from the 2D system of partial differential equations. The possible interface elastic brittle delamination will be studied under the satisfied restriction for energy release ratio related to the first appearance of mode II along the interface. 2. The shear lag model will be applied to reduce the 2D theory of elasticity to a 1D dynamic system of equations for the axial stresses and displacements of the piezoelectric smart structure for all three zones along the interface. For this purpose an appropriate modelling will be performed for the given interface defect. Further depending of the location of the interface void, the debond interfacial length appearing from the left or/and right sides of the overlap zone of the structure will be determined. The possible criterion for detecting the interface debond length by the respective value of the electric gradient at fixed loading, material and geometric characteristics will be proposed. On the base of the optimal analysis, the optimal structure with a restriction for an absence of interface delamination will be proposed.

研究目标可以总结如下：1。为了获得简单的耦合系统，用于普通微分方程的简单耦合系统，用于智能hygropiezothermal patch/layer结构的动态时间谐波行为，并具有从部分微分方程的2D系统的初步给定位置。在满足沿界面模式II的首次出现的能量释放比的满意限制下，将研究可能的界面弹性脆性分层。 2。将应用剪切滞后模型将弹性的2D理论降低到沿界面所有三个区域的压电智能结构的轴向应力和位移的1D动态系统。为此，将针对给定的接口缺陷执行适当的建模。进一步取决于界面空隙的位置，将确定从结构的重叠区的左侧或右侧出现的Debond界面长度。将提出在固定载荷，材料和几何特性下通过电梯度的各个值检测界面删除长度的可能标准。在最佳分析的基础上，将提出具有限制界面分层的最佳结构。

项目成果

EFFECT OF AN INTERFACE DEFECT IN A PATCH/LAYER JOINT UNDER DYNAMIC TIME HARMONIC LOAD

动态时谐波载荷下补片/层接头中界面缺陷的影响

• DOI: 10.1002/cepa.543
• 发表时间: 2017
• 期刊: ce/papers
• 作者: E. Kirilova;W. Becker;J. Ivanova;T. Petrova
• 通讯作者: T. Petrova

MODELING OF SMART PATCH/LAYER JOINTS UNDER DYNAMIC TIME HARMONIC LOAD WITH INTERFACE DEFECT

具有界面缺陷的动态时谐波载荷下智能补片/层接头的建模

• DOI: 10.1002/cepa.548
• 发表时间: 2017
• 期刊: ce/papers
• 作者: T. Petrova;W. Becker;E. Kirilova;J. Ivanova
• 通讯作者: J. Ivanova