Multi-target ultra-high-vacuum (UHV) RF Sputtering System

多靶超高真空（UHV）射频溅射系统

• 批准号: 282221095
• 金额: --
• 依托单位: Universität zu Köln
• 依托单位国家: 德国
• 项目类别: Major Research Instrumentation
• 财政年份: 2015
• 资助国家: 德国
• 起止时间: 2014-12-31 至 无数据
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/282221095?language=en
• 关键词: Multi; target; ultra; vacuum; UHV; Multi; target; ultra; vacuum; UHV

The head of the group is a researcher of topological insulators (TIs) and topological superconductors (TSCs). Our group has been doing research at Osaka University, but is moving to the University of Cologne to focus more on the fundamental physics of TIs and TSCs. One of the objectives of our research is to discover novel quantum phenomena in TIs and TSCs, which requires fabrications of state-of-the-art devices based on these materials. For this purpose, the University of Cologne will build a dedicated clean room for our group. The RF sputtering system is a general and essential tool for depositing metals and insulators in the nano-device fabrication process. Needless to say, such a process must be done within the same clean room as the other lithography processes. Therefore, an RF sputtering system is a necessary apparatus in a clean room for nanodevice fabrications.

该小组的负责人是拓扑绝缘子（TIS）和拓扑超导体（TSC）的研究人员。我们的小组一直在大阪大学进行研究，但正在搬到科隆大学，更多地专注于TIS和TSC的基本物理。我们研究的目标之一是发现TIS和TSC中的新型量子现象，该现象需要基于这些材料的最先进设备的制造。为此，科隆大学将为我们的团队建造一个专门的清洁室。 RF溅射系统是将金属和绝缘子沉积在纳米装置制造过程中的一般和必不可少的工具。不用说，必须在与其他光刻过程相同的清洁室内完成这样的过程。因此，射频溅射系统是纳米维克制造的干净房间中必要的设备。