Travel: Travel support for SmartSP 2023

旅行:SmartSP 2023 的旅行支持

基本信息

  • 批准号:
    2330018
  • 负责人:
  • 金额:
    $ 0.8万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2023
  • 资助国家:
    美国
  • 起止时间:
    2023-08-01 至 2024-07-31
  • 项目状态:
    已结题

项目摘要

Recent decades have witnessed an extraordinary growth in cyber-physical systems (CPS) such as self-driving vehicles, robotic devices, and drones. The First EAI SmartSP2023 conference, an independent conference, provides a valuable venue for the cyber-physical systems (CPS) research, with a particular focus on smart vehicles, smart transportation, and corresponding security challenges. The conference brings together leading experts worldwide to share knowledge, explore emerging trends and technologies, and address the many challenges associated with these technologies. The conference is particularly relevant for students and early-career researchers seeking to expand their knowledge, develop essential career skills, and engage in discussions with leading experts in the field. Attendees will have the opportunity to attend technical sessions, present their research, and participate in panel discussions and networking events. The conference will also provide opportunities for students to meet with leading experts in the field, explore potential career opportunities, and gain valuable insights into the latest research and emerging technologies in CPS and smart vehicles.The conference grant helps cover travel expenses for student attendees. The selection will be based on a range of criteria, including academic achievement and research experience and will give priority to students who have demonstrated a commitment to advancing the field. Assessment of learning outcome for student attendees will be conducted through a range of methods, including pre- and post-conference surveys, feedback from student presentations, and evaluations of student engagement in technical sessions and discussions. The conference organizers will work with participating universities and research institutions to ensure that students receive credit for attending the conference and that their participation is recognized as part of their academic and professional development.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
近几十年来,自动驾驶汽车、机器人设备和无人机等网络物理系统 (CPS) 取得了惊人的增长。第一届 EAI SmartSP2023 会议是一次独立会议,为网络物理系统 (CPS) 研究提供了宝贵的场所,特别关注智能车辆、智能交通和相应的安全挑战。该会议汇集了世界各地的领先专家,分享知识,探索新兴趋势和技术,并解决与这些技术相关的许多挑战。该会议对于寻求扩展知识、发展基本职业技能并与该领域领先专家进行讨论的学生和早期职业研究人员尤其重要。与会者将有机会参加技术会议、展示他们的研究成果并参加小组讨论和社交活动。会议还将为学生提供与该领域领先专家会面的机会,探索潜在的职业机会,并获得有关 CPS 和智能汽车的最新研究和新兴技术的宝贵见解。会议补助金有助于支付学生与会者的旅费。选择将基于一系列标准,包括学术成就和研究经验,并将优先考虑那些致力于推进该领域的学生。将通过一系列方法对学生参加者的学习成果进行评估,包括会前和会后调查、学生演讲的反馈以及对学生参与技术会议和讨论的评估。会议组织者将与参与的大学和研究机构合作,确保学生获得参加会议的学分,并确保他们的参与被视为其学术和专业发展的一部分。该奖项反映了 NSF 的法定使命,并被认为值得通过以下方式支持:使用基金会的智力价值和更广泛的影响审查标准进行评估。

项目成果

期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)

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Kaichen Yang其他文献

CloudLeak: Large-Scale Deep Learning Models Stealing Through Adversarial Examples
CloudLeak:大规模深度学习模型通过对抗性示例进行窃取
Graph Neural Network based Hardware Trojan Detection at Intermediate Representative for SoC Platforms
SoC 平台中级代表基于图神经网络的硬件木马检测
Robust Adversarial Objects against Deep Learning Models
针对深度学习模型的鲁棒对抗对象
  • DOI:
    10.1609/aaai.v34i01.5443
  • 发表时间:
    2020-04-03
  • 期刊:
  • 影响因子:
    1.4
  • 作者:
    Tzungyu Tsai;Kaichen Yang;Tsung;Yier Jin
  • 通讯作者:
    Yier Jin
Hardware Phi-1.5B: A Large Language Model Encodes Hardware Domain Specific Knowledge
硬件 Phi-1.5B:编码硬件领域特定知识的大型语言模型
Robust Roadside Physical Adversarial Attack Against Deep Learning in Lidar Perception Modules
针对激光雷达感知模块中深度学习的强大路边物理对抗攻击

Kaichen Yang的其他文献

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{{ truncateString('Kaichen Yang', 18)}}的其他基金

ERI: Towards Robust and Secure Intelligent 3D Sensing Systems
ERI:迈向稳健、安全的智能 3D 传感系统
  • 批准号:
    2347426
  • 财政年份:
    2024
  • 资助金额:
    $ 0.8万
  • 项目类别:
    Standard Grant

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