EAGER: Ultra Broadband Fully Integrated GaN Front End Integrated Chip

EAGER:超宽带全集成GaN前端集成芯片

基本信息

项目摘要

The Historically Black Colleges and Universities - Undergraduate Program (HBCU-UP) provides support to strengthen STEM undergraduate education and research at HBCUs. This EArly-concept Grant for Exploratory Research (EAGER) expresses the need for innovative research activity in integrated chip design, fabrication, and validation at Florida A&M University (FAMU). The project focuses on the development of fully integrated GaN front end chips covering a wide spectrum. This work will be accomplished via investigation of a novel transversal filter type circuit topology to boost the efficiency of power amplification. The establishment of this research effort will further enhance the research capacity at FAMU in direct response to the CHIPS and Science Act.The goal of this project is to develop a novel transversal filter type broadband distributed power amplifier, a wideband radio frequency switch, a low noise amplifier, a fully integrated solution, and novel packaging and set up of an experimental validation test bench for the proposed chip. Additionally, the project seeks to 1) develop a course for integrated chip design, fabrication, and validation, 2) develop a summer research program for undergraduate students, and 3) share the developed course materials with other HBCUs promoting the research activities in semiconductor, chip design, and experiment validation.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
历史悠久的黑人学院和大学 - 本科课程(HBCU -UP)为加强HBCUS的STEM本科教育和研究提供了支持。这项对探索性研究(急切)的早期概念赠款表示需要在佛罗里达州A&M大学(FAMU)的综合芯片设计,制造和验证中进行创新研究活动。该项目着重于涵盖广泛范围的完全集成的GAN前端芯片的开发。这项工作将通过研究新型的横向滤波器类型电路拓扑来实现,以提高功率扩增的效率。这项研究工作的建立将进一步提高FAMU的研究能力,以直接响应芯片和科学法案。该项目的目的是开发一种新型的横向滤波器类型宽带分布式功率放大器,宽带射频开关,低噪声放大器,完全集成的解决方案以及新颖集成的解决方案以及新颖的包装和实验验证测试板的新颖包装和设置。此外,该项目寻求1)开发一门集成芯片设计,制造和验证的课程,2)为本科生开发夏季研究计划,以及3)与其他H​​BCU共享开发的课程材料,促进了半导体,芯片设计和实验验证中的研究活动,这些奖项通过NSF的授权和范围的启用。 标准。

项目成果

期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)

暂无数据

数据更新时间:2024-06-01

Bayaner Arigong的其他基金

CAREER: Frequency Agile Real-Time Reconfigurable RF Analog Co-Processor Design Leveraging Engineered Nanoparticle and 3D Printing
职业:利用工程纳米颗粒和 3D 打印进行频率捷变实时可重构射频模拟协处理器设计
  • 批准号:
    2340268
    2340268
  • 财政年份:
    2024
  • 资助金额:
    $ 30万
    $ 30万
  • 项目类别:
    Continuing Grant
    Continuing Grant
Track 1 EFRI DCL: Planning Grant: Brain Inspired Intelligence Distributing High Efficiency RF/Analog Signal Processing Circuit
Track 1 EFRI DCL:规划拨款:大脑启发智能分配高效射频/模拟信号处理电路
  • 批准号:
    2217637
    2217637
  • 财政年份:
    2022
  • 资助金额:
    $ 30万
    $ 30万
  • 项目类别:
    Standard Grant
    Standard Grant
HBCU-UP DCL OPEN: Acquisition of Compact Wideband Integrated Near Field Passive Measurement and OTA Measurement System
HBCU-UP DCL OPEN:收购紧凑型宽带集成近场无源测量和 OTA 测量系统
  • 批准号:
    2230248
    2230248
  • 财政年份:
    2022
  • 资助金额:
    $ 30万
    $ 30万
  • 项目类别:
    Standard Grant
    Standard Grant
Collaborative Research: SHF: Small: Tangram: Scaling into the Exascale Era with Reconfigurable Aggregated "Virtual Chips"
合作研究:SHF:小型:七巧板:通过可重构聚合“虚拟芯片”扩展到百亿亿次时代
  • 批准号:
    2124525
    2124525
  • 财政年份:
    2021
  • 资助金额:
    $ 30万
    $ 30万
  • 项目类别:
    Standard Grant
    Standard Grant
Collaborative Research: SWIFT: SMALL: Continuous-tuning matrix-beamforming MIMO enabled multi-mode injection-locking passive Wi-Fi sensing
合作研究:SWIFT:SMALL:支持连续调谐矩阵波束成形 MIMO 的多模式注入锁定无源 Wi-Fi 传感
  • 批准号:
    2124531
    2124531
  • 财政年份:
    2021
  • 资助金额:
    $ 30万
    $ 30万
  • 项目类别:
    Standard Grant
    Standard Grant
Collaborative Research: SWIFT: SMALL: Continuous-tuning matrix-beamforming MIMO enabled multi-mode injection-locking passive Wi-Fi sensing
合作研究:SWIFT:SMALL:支持连续调谐矩阵波束成形 MIMO 的多模式注入锁定无源 Wi-Fi 传感
  • 批准号:
    2030244
    2030244
  • 财政年份:
    2020
  • 资助金额:
    $ 30万
    $ 30万
  • 项目类别:
    Standard Grant
    Standard Grant
Collaborative Research: SHF: Small: Tangram: Scaling into the Exascale Era with Reconfigurable Aggregated "Virtual Chips"
合作研究:SHF:小型:七巧板:通过可重构聚合“虚拟芯片”扩展到百亿亿次时代
  • 批准号:
    2007796
    2007796
  • 财政年份:
    2020
  • 资助金额:
    $ 30万
    $ 30万
  • 项目类别:
    Standard Grant
    Standard Grant

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