FuSe-TG: Heterogeneous module, array antenna, and IC co-design for energy-efficient D-band wireless communications and radar

FuSe-TG：异构模块、阵列天线和 IC 协同设计，用于节能 D 频段无线通信和雷达

• 批准号: 2235336
• 负责人: Wooram Lee
• 金额: $ 30万
• 依托单位: Pennsylvania State Univ University Park
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-06-15 至 2025-05-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2235336&HistoricalAwards=false
• 关键词: FuSe; TG; Heterogeneous; module; array

Future wireless communication and radar technologies above 100 GHz will enable high-speed data transmission and high-resolution radar sensing, which will be the foundation to enable people and things to connect and interact with one another across physical and virtual spaces seamlessly. One of the key enablers for these technologies is a large-scale antenna array module, where multiple radio transmitters and receivers are integrated with a group of antennas for high-speed data transmission over a longer distance. This project will address the key co-design and integration challenges of implementing a large-scale antenna array module above 100 GHz. The scope of the proposed co-design study covers both high-performance-driven integration platforms for potential defense-related applications and volume-driven cost-effective packaging technologies for commercial use cases. The research insights from this project can be adopted via industry engagement to develop new process technologies and therefore will benefit a wide range of semiconductor manufacturing companies in the United States. The success of the project will also help maintain the continuous leadership of the United States in wireless technologies and semiconductors by training students into innovative engineers.To overcome severe path loss and limited transistor performance above 100 GHz, silicon-based large-scale phased array transceivers are essential to realizing D-band (110-170 GHz) wireless communications and radar. For the development of D-band phased array modules, the small size of antenna-in-package (AiP), which scales down with wavelength, poses electromagnetic, thermal, and manufacturing challenges. To address these, we propose a holistic IC/package/antenna/system co-design approach based on heterogeneous integration for a scalable phased array module above 100 GHz. We will study a scalable D-band aperiodic phased array architecture without the constraint of λ/2 antenna spacing as a stepstone example to establish our teaming environment and demonstrate the proposed approaches. For the heterogeneous integration of different chiplets and antenna arrays at frequencies100 GHz, we will investigate emerging packaging technologies such as fan-out wafer-level packaging (FOWLP) and SLIC to address the combined electromagnetic, IC/signal routing density, and thermal challenges. We will also develop new D-band antenna design principles using substrate-integrated waveguide (SIW) based composite right/left-handed (CRLH) metamaterial resonator for wide bandwidth and dual-polarization support. These collaborative efforts will pave the way for the development of a scalable phased array module above 100 GHz with more element count, higher energy efficiency, better thermal management, and greater manufacturability. This will be the key enabler to realizing next-generation ultra-wideband wireless communications and radar that offer the potential for revolutionary applications including industrial automation, immersive augmented and virtual reality, holographic telepresence, and self-driving cars.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

未来100 GHz以上的无线通信和雷达技术将实现高速数据传输和高分辨率雷达传感，这将成为使人和物跨越物理和虚拟空间无缝连接和交互的基础之一。这些技术的关键推动因素是大规模天线阵列模块，其中多个无线电发射器和接收器与一组天线集成，以实现更长距离的高速数据传输。该项目将解决关键的协同设计和集成挑战。实现大型天线拟议的协同设计研究的范围涵盖用于潜在国防相关应用的高性能驱动的集成平台和用于商业用例的体积驱动的经济高效的封装技术。可以通过行业参与来开发新的工艺技术，因此将使美国广泛的半导体制造公司受益。该项目的成功还将有助于通过培训保持美国在无线技术和半导体领域的持续领先地位。学生转变为创新工程师。克服严重的路径损耗和有限的晶体管为了实现100 GHz以上的性能，硅基大规模相控阵收发器对于实现D频段（110-170 GHz）无线通信和雷达至关重要。对于D频段相控阵模块的开发，天线尺寸要小。封装（AiP）随波长缩小，带来了电磁、热和制造方面的挑战，为了解决这些问题，我们提出了一种基于 IC/封装/天线/系统的整体协同设计方法。 100 GHz 以上的可扩展相控阵模块的异构集成我们将研究一种不受 λ/2 天线间距限制的可扩展 D 频段非周期相控阵架构，作为建立我们的组合环境并演示所提出的方法的垫脚石示例。由于在 100 GHz 频率下不同芯片和天线阵列的异构集成，我们将研究扇出晶圆级封装 (FOWLP) 和 SLIC 等新兴封装技术，以解决我们还将利用基于基板集成波导 (SIW) 的复合右/左手 (CRLH) 超材料谐振器开发新的 D 波段天线设计原理，以实现宽带宽和双天线。这些协作努力将为开发 100 GHz 以上的可扩展相控阵模块铺平道路，该模块具有更多的元件数量、更高的能源效率、更好的热管理和更高的可制造性。成为实现下一代超宽带无线通信和雷达的关键推动者，为工业自动化、沉浸式增强和虚拟现实、全息远程呈现和自动驾驶汽车等革命性应用提供潜力。该奖项反映了 NSF 的法定使命，并具有通过使用基金会的智力优点和更广泛的影响审查标准进行评估，被认为值得支持。