PFI-TT: Enhancing Manufacturing with Real-Time Defect Detection using mm-Wave Antenna Sensors

PFI-TT:使用毫米波天线传感器通过实时缺陷检测增强制造

基本信息

项目摘要

The broader impact/commercial potential of this Partnerships for Innovation - Technology Translation (PFI-TT) project is to increase semiconductor package production yield, reliability, and cost-effectiveness by introducing an in-situ or in-line sensing mechanism with real-time production corrective actions. The detection of issues during manufacturing is enabled by mm-Wave antenna sensors that can detect hidden process defects based on embedded metal and dielectric features in real time. One of the goals of this project is to overcome key manufacturing bottlenecks in high-density wiring substrates with several component integrations for advanced packaging. Another goal is to reduce, and perhaps, eliminate waste impact and carbon footprint on the environment via intelligent Additive Manufacturing. The proposed manufacturing path will generate new manufacturing tool business opportunities across the electronics supply chain. Upon successful completion of the project, the new sensing technology will be licensed. The project will also provide an ideal opportunity to prepare the next-generation workforce with strong technical and communication skills as well as experience in manufacturing challenges and market trends. The proposed project will develop a unique, noncontact, real-time detection system for hidden manufacturing defects in electronics with the goal of achieving in-line process control for reproducibility, tolerance and yield, eventually leading to high-density electronics integration. This technology will be achieved through an innovative mm-Wave antenna array sensing system to reveal hidden metal-dielectric features through backscattering. Detection of spectra and amplitude shifts will be classified or mapped into defect categories through machine learning algorithms for real-time corrective actions. The advancement of antennas with smaller Radar Cross-Sections (RCS) has allowed the design of mm-Wave sensors with a broad impact in several areas, including 6G communications, healthcare, safety, and security products. In this PFI-TT project, the mm-Wave noncontact probing system will be integrated into production-scale 3D printing systems to achieve defect-free manufacturing by collaborating with a technology partner. The proposed mm-Wave sensing brings precision impedance-matched Radio Frequency (RF) interconnects and antennas, all coupled with advances in wiring design for active embedding. Further, continuous remote in-line monitoring for scalable high-volume manufacturing can lead to solutions for the self-healing of manufacturing defects. Overall, this new technology may have a pervasive role in future heterogeneous system manufacturing.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
这种伙伴关系对创新 - 技术翻译(PFI-TT)项目的更广泛的影响/商业潜力是通过引入实时生产纠正措施的天间或在线感应机制,从而提高半导体包装的生产收益,可靠性和成本效益。 MM波天线传感器可实现制造过程中问题的检测,这些传感器可以实时检测基于嵌入式金属和介电特征的隐藏过程缺陷。该项目的目标之一是克服高密度接线基板的关键制造瓶颈,并具有用于高级包装的几个组件集成。另一个目标是通过智能添加剂制造减少,也许可以消除对环境的废物影响和碳足迹。拟议的制造路径将在电子供应链中产生新的制造工具商机。成功完成项目后,将获得新的传感技术。该项目还将提供理想的机会,以准备具有强大技术和沟通能力的下一代劳动力以及在制造挑战和市场趋势方面的经验。拟议的项目将开发一个独特的,非接触的实时检测系统,用于电子设备中隐藏的制造缺陷,目的是实现在线过程控制,以实现可重复性,耐受性和产量,最终导致高密度电子集成。这项技术将通过创新的MM-Wave天线阵列传感系统来实现,以通过反向散射揭示隐藏的金属二级功能。通过机器学习算法进行实时纠正措施,将检测光谱和振幅变化分类或映射到缺陷类别中。具有较小雷达横截面(RCS)的天线的进步允许设计MM波传感器,并在几个领域(包括6G通信,医疗保健,安全和安全产品)上产生了广泛影响。在这个PFI-TT项目中,MM波非接触型探测系统将集成到生产规模的3D打印系统中,以通过与技术合作伙伴协作来实现无缺陷的制造。所提出的MM波感应带来了精确阻抗匹配的射频(RF)互连和天线,所有这些都与接线设计的进步相结合,以进行主动嵌入。此外,对可扩展的大容量制造的连续远程监控可以导致用于自我修复制造缺陷的解决方案。总体而言,这项新技术可能在未来的异质体系制造中发挥了普遍的作用。该奖项反映了NSF的法定任务,并且使用基金会的知识分子优点和更广泛的影响审查标准,被认为值得通过评估来获得支持。

项目成果

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Markondeya Raj Pulugurtha其他文献

Markondeya Raj Pulugurtha的其他文献

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{{ truncateString('Markondeya Raj Pulugurtha', 18)}}的其他基金

Collaborative Research: FuSe: Thermal Co-Design for Heterogeneous Integration of Low Loss Electromagnetic and RF Systems (The CHILLERS)
合作研究:FuSe:低损耗电磁和射频系统异构集成的热协同设计(CHILLERS)
  • 批准号:
    2329208
  • 财政年份:
    2023
  • 资助金额:
    $ 25万
  • 项目类别:
    Continuing Grant
I-Corps: Power Single-Layer Integration with Component Embedding for Wearable and Internet of Things (IoT) Electronics
I-Corps:为可穿戴和物联网 (IoT) 电子产品提供具有组件嵌入的单层集成电源
  • 批准号:
    2131701
  • 财政年份:
    2021
  • 资助金额:
    $ 25万
  • 项目类别:
    Standard Grant
EAGER: SARE: Multiferroic Shields for Smart Analog Security
EAGER:SARE:用于智能模拟安全的多铁屏蔽
  • 批准号:
    2029007
  • 财政年份:
    2020
  • 资助金额:
    $ 25万
  • 项目类别:
    Standard Grant

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