SBIR Phase I: Full surface angstrom-level contamination and defect detection on thin glass samples

SBIR 第一阶段：薄玻璃样品的全表面埃级污染和缺陷检测

• 批准号: 2126628
• 负责人: Steven Meeks
• 金额: $ 25.6万
• 依托单位: LUMINA INSTRUMENTS INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2021
• 资助国家: 美国
• 起止时间: 2021-08-01 至 2022-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2126628&HistoricalAwards=false
• 关键词: SBIR; Phase; Full; surface; angstrom

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project is to improve yield and reduce the costs of glass-based semiconductor processing and packaging. The project develops a novel optical scanning technology for high throughput, full surface inspection of glass panels. Glass is increasingly finding application in semiconductor processing, packaging, and AR/VR (augmented/virtual reality) applications, with the global glass wafer market expected to increase significantly in the next few years. However, nearly all process control tools are designed to inspect silicon rather than glass. Current pain points in glass inspection include detecting atomic-sized organic contamination on transparent surfaces, distinguishing contamination on the top or bottom surface of very thin glass, detecting microscopic particles on glass, and detecting internal defects within a glass block. This Small Business Innovation Research (SBIR) Phase I project develops an innovative scanning polarization imaging technology to enable rapid, full surface scanning and imaging of sub-nanometer film coatings and defects. The full-surface inspection capability with a 100-mm field of view in this Phase I project will allow manufacturers and producers of augmented/virtual reality, high frequency, and biomedical devices to perform incoming inspections of the substrates and perform process monitoring through the sampling of their substrates throughout the fabrication processes. Compared to other thin-film defect measurement systems, this technology offers shape-independent full surface scanning (as opposed to spot checks provided by current technologies such as ellipsometry, optical or Fourier-transform infrared microscopy), detection of film defects as small as 5 angstroms on glass, and top/bottom surface distinction capabilities on thin glass substrates. These combined capabilities are critical in industries where small particulate or film contamination on glass can lead to failure of downstream steps and a faulty final product.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该小型企业创新研究 (SBIR) 第一阶段项目的更广泛影响/商业潜力是提高产量并降低基于玻璃的半导体加工和封装的成本。 该项目开发了一种新颖的光学扫描技术，用于玻璃面板的高通量、全表面检测。玻璃越来越多地应用于半导体加工、封装和AR/VR（增强/虚拟现实）应用，全球玻璃晶圆市场预计在未来几年将大幅增长。 然而，几乎所有过程控制工具都设计用于检查硅而不是玻璃。当前玻璃检测的难点包括检测透明表面上原子大小的有机污染物、区分非常薄玻璃的顶部或底部表面上的污染物、检测玻璃上的微观颗粒以及检测玻璃块内的内部缺陷。该小型企业创新研究 (SBIR) 第一阶段项目开发了一种创新的扫描偏振成像技术，可实现亚纳米薄膜涂层和缺陷的快速、全表面扫描和成像。 第一阶段项目中具有 100 毫米视场的全表面检测能力将使增强/虚拟现实、高频和生物医学设备的制造商和生产商能够对基材进行来料检测，并通过采样进行过程监控。他们的基板在整个制造过程中。与其他薄膜缺陷测量系统相比，该技术提供与形状无关的全表面扫描（与椭圆光度术、光学或傅里叶变换红外显微镜等当前技术提供的抽查相反），可检测小至 5 个薄膜缺陷玻璃上的埃，以及薄玻璃基板上的顶/底表面区分能力。这些综合能力对于玻璃上的小颗粒或薄膜污染可能导致下游步骤失败和最终产品有缺陷的行业至关重要。该奖项反映了 NSF 的法定使命，并通过使用基金会的智力优势和更广泛的评估进行评估，被认为值得支持。影响审查标准。