US-Japan Joint Workshop on Thermal Transport, Materials Informatics and Quantum Computing

美日热传输、材料信息学和量子计算联合研讨会

• 批准号: 2124850
• 负责人: Tengfei Luo
• 金额: $ 1.99万
• 依托单位: University of Notre Dame
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2021
• 资助国家: 美国
• 起止时间: 2021-04-01 至 2022-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2124850&HistoricalAwards=false
• 关键词: US; Japan; Joint; Workshop; Thermal

This award is to support the US-Japan Joint Workshop on Thermal Transport, Materials Informatics and Quantum Computing to be held virtually on March 22-25, 2021 over the ZOOM and Gather.Town platforms. With the recent advances in artificial intelligence (AI), there is an opportunity to leverage AI to further advance thermal transport so as to maximize the ability to systematically develop thermal materials with desirable properties, i.e., materials-by-design. This workshop seeks to promote conversations among the thermal transport communities and the greater machine learning and materials informatics communities to cultivate international collaborations with Japanese researchers. Quantum computing, as one of important topics in materials informatics, is also a key element of this workshop. The workshop is designed to maximize diversity and inclusion via broadening participations of researchers and engineers from diverse backgrounds and inviting speakers from underrepresented groups. This US-Japan joint workshop brings together researchers from academia, national lab, and industry in both US and Japan to cultivate research collaborations in AI, Materials Informatics, Thermal Transport, and Quantum Computing. It features four themes: Data Infrastructure, AI-driven Experimental Discovery, Simulation-aided Materials Informatics & Thermal Transport, and AI and Quantum Computing. The new opportunities and future research directions identified from this workshop will be disseminated through a perspective article. The AI- and quantum-fueled advances in thermal transport research will also benefit innovations in industry. The workshop will initiate exchanges of students, postdoctoral fellows and faculty, as well as sharing of research facilities between the U.S. and Japan. This workshop will also provide the next generation of scientists and engineers a platform to interact with established researchers and their peers from diverse backgrounds.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

该奖项旨在支持将于 2021 年 3 月 22 日至 25 日在 ZOOM 和 Gather.Town 平台虚拟举行的美日热传输、材料信息学和量子计算联合研讨会，以表彰人工智能 (AI) 的最新进展。 ，有机会利用人工智能进一步推进热传输，从而最大限度地提高开发具有所需性能的热材料的能力，即材料设计本研讨会旨在促进之间的对话。热传输社区以及更大的机器学习和材料信息学社区与日本研究人员建立国际合作，作为材料信息学的重要主题之一，也是本次研讨会的一个关键要素。通过扩大来自不同背景的研究人员和工程师的参与，并邀请来自代表性不足群体的演讲者来实现包容性，这个美日联合研讨会汇集了来自美国和日本学术界、国家实验室和工业界的研究人员，以培养人工智能领域的研究合作，材料信息学、热传输和量子计算有四个主题：数据基础设施、人工智能驱动的实验发现、模拟辅助材料信息学和热传输以及人工智能和量子计算。将通过一篇观点文章进行传播。人工智能和量子驱动的热传输研究进展也将有利于行业发起的创新。该研讨会还将为下一代科学家和工程师提供一个与知名研究人员及其来自不同背景的同行互动的平台。该奖项反映了 NSF 的贡献。法定使命，并通过使用基金会的智力优点和更广泛的影响审查标准进行评估，被认为值得支持。