Seamless Additive Manufacturing of Electrical Circuits Inside Polymers for Multifunctional 3D Components

用于多功能 3D 组件的聚合物内部电路的无缝增材制造

• 批准号: 2001081
• 负责人: Rajiv Malhotra
• 金额: $ 50万
• 依托单位: Rutgers University New Brunswick
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2020
• 资助国家: 美国
• 起止时间: 2020-09-01 至 2025-08-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2001081&HistoricalAwards=false
• 关键词: Seamless; Additive; Manufacturing; Electrical; Circuits

Additive Manufacturing (AM) of polymers uses layer-by-layer material deposition to create complex three-dimensional (3D) objects. Combining AM with printing of metallic electrical circuits inside the 3D object can drastically enhance the functional capabilities of 3D parts. While many such fabrication approaches have been suggested, they impose a tradeoff between electronic performance, material capability, and material cost. This project will create new knowledge on a novel process that breaks this tradeoff. Multifunctional 3D parts are in increasing demand for aerospace, robotics, healthcare, defense, and Internet-of-Things applications. Thus, the new manufacturing capabilities enabled by this project will have multiple transformative socio-economic benefits and stimulate a new generation of product innovations in the additive manufacturing industry. This research will combine several disciplines including manufacturing, thermal, mechanics, optics, and materials science. This project will create multiple outreach testbeds for engaging women and underrepresented minorities across high school, middle school, and undergraduate levels. This team will engage industry by organizing additive manufacturing symposia, and perform public outreach via the creation of video articles. This integration of research and education will encourage diversity in engineering and manufacturing across multiple educational levels.This project’s goal is to enable concurrent 3D printing of polymer parts and electrically conductive metal circuits inside the part while achieving high electrical conductivity and low material cost. This research will test the hypothesis that flash light fusion of core-shell nanowires and physics-informed tuning of the process parameters can achieve those goals. Coupled optical, thermal, mass transfer and mechanical models over multiple length scales will be created and experimentally validated. This research will fill key knowledge gaps on the dynamics of optically-driven fusion in core-shell nanowires, thermomechanically-driven changes in circuit conductivity during polymer printing, and the relationship between the process parameters and performance. The outcome will be a scientific foundation for systemic realization of a performance-cost-material window that is not achievable with existing processes.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

聚合物的添加剂制造（AM）使用层材料沉积来创建X。减小（3D）对象。他们是造成的，在电子效果，材料成本和材料成本之间实现了折衷方案。启用了多种变革性的OCIO经济上的添加剂制造业中的产品创新。学校和地下的水平将通过组织添加的研讨会，并通过创建视频文章来进行公共活动。零件可以实现高电导率和低材料的成本聚合物打印过程中的电路传导性的变化以及过程rmance之间的关系。

项目成果

Accelerated and Inexpensive Machine Learning for Manufacturing Processes with Incomplete Mechanistic Knowledge

• DOI: 10.1016/j.mfglet.2023.07.017
• 发表时间: 2023-04
• 期刊: ArXiv
• 作者: J. Cleeman;K. Agrawala;R. Malhotra

Flash light assisted additive manufacturing of 3D structural electronics (FLAME)

闪光灯辅助 3D 结构电子增材制造 (FLAME)

• DOI: 10.1016/j.jmapro.2022.08.003
• 发表时间: 2022
• 期刊: Journal of Manufacturing Processes
• 影响因子: 6.2
• 作者: Jahangir, Md Naim;Cleeman, Jeremy;Pan, Changqin;Chang, Chih-Hung;Malhotra, Rajiv
• 通讯作者: Malhotra, Rajiv

Partial-Physics-Informed Multi-fidelity Modeling of Manufacturing Processes

• DOI: 10.1016/j.jmatprotec.2023.118125
• 发表时间: 2023-08
• 期刊: Journal of Materials Processing Technology
• 影响因子: 6.3
• 作者: J. Cleeman;K. Agrawala;Evan Nastarowicz;R. Malhotra

Inkjet-printed p-type CuBI : wearable thin-film transistors

喷墨印刷 p 型 CuBI：可穿戴薄膜晶体管

• DOI: 10.1039/d2ma00425a
• 发表时间: 2022
• 期刊: Materials Advances
• 影响因子: 5
• 作者: Li, Shujie;Liebe, Brayden;Son, Changjin;Kim, Taehyeon;Surprenant, Shelby;Rochefort, Skip;Lim, Sangwoo;Malhotra, Rajiv;Chang, Chih-Hung
• 通讯作者: Chang, Chih-Hung

Multiscale Modeling of Sintering-Driven Conductivity in Large Nanowire Ensembles

大型纳米线集合中烧结驱动电导率的多尺度建模

• DOI: 10.1021/acsami.1c16581
• 发表时间: 2021
• 期刊: ACS Applied Materials & Interfaces
• 影响因子: 9.5
• 作者: Devaraj, Harish;Tian, Qi;Guo, Weihong;Malhotra, Rajiv
• 通讯作者: Malhotra, Rajiv