LEAP-HI/GOALI: DfAM of Smart Materials Using a Machine Learning Approach

LEAP-HI/GOALI：使用机器学习方法的智能材料 DfAM

• 批准号: 1953259
• 负责人: Mary Frecker
• 金额: $ 50万
• 依托单位: Pennsylvania State Univ University Park
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2020
• 资助国家: 美国
• 起止时间: 2020-09-01 至 2023-02-28
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1953259&HistoricalAwards=false
• 关键词: LEAP; HI; GOALI; DfAM; Smart

This Leading Engineering for America's Prosperity, Health, and Infrastructure (LEAP-HI) / Grant Opportunity for Academic Liaison with Industry (GOALI) project addresses the complex technical challenge of automated design and additive manufacturing (AM) of customized smart materials and devices. Additive manufacturing, or 3D printing, is a layer-wise approach to manufacturing that is rapidly becoming a viable method for large scale production. The medical device industry, in particular, stands to benefit from AM through manufacture of customizable devices for particular patients, diseases, and/or stages of healing. The project advances AM by developing the ability to print “smart” materials that can change shape in response to external stimuli. The technical challenges are motivated by a medical device industry need identified by the industrial partner, Actuated Medical Incorporated (AMI), for patient-specific adaptive devices that are capable of actively changing their shape at periodic intervals as the patient’s needs change. The active polymer materials developed as part of the project are printed in a single AM process and will provide customized multifunctional devices with fully integrated actuation to advance the state of the art in patient-specific medical devices.The intellectual merit of the researched work resides in the convergence of distinct, yet related and mutually beneficial, areas: smart materials, design, additive manufacturing, and industrial scale-up and integration. Despite the evolution of AM technologies and the ever-expanding growth of smart materials, including printable ones, few researchers have demonstrated the 3D printing of multifunctional multi-material structures and devices. The project addresses this gap in knowledge through the integration of processing, modeling, design and characterization, and by investigating the complex interactions between multiple foci. The technical contributions are: (1) development of functionally graded thermoset polymers with customized shape memory and magneto-mechanical response capabilities, and (2) development of a novel AM fabrication process that is capable of conformal printing and functional grading of multiple materials. In collaboration with the industrial partner, the investigators will develop appropriate performance and fabrication requirements and scale up the research results through direct involvement of students and faculty at the industry partner’s facility, while accounting for regulatory requirements.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这个领先的英语对美国的繁荣，健康和基础设施（LEAP-HI）项目解决了自动设计和添加剂制造（AM）的复杂技术挑战（AM）。尤其是为特定的患者和/或疗法的阶段制造可自定义的设备，可以从AM中受益。由工业合作伙伴（AMI）需要的医疗设备行业，适用于患者特定的自适应装置，能够积极地改变其形状，因为该项目在项目中开发的活跃聚合物材料。 AM流程，并将为Custimimed L设备与特定于艺术的医疗设备的状态完全集成。尽管AM技术的发展和智能材料的越来越多，但很少有研究人员证明了多功能材料结构和设备的3D打印。设计和表征的技术贡献是：（1）具有记忆力和机械能力的功能分级的热固性聚合物，以及（2）能够概念和功能分级的新型AM制造过程，调查人员的意愿和制造要求并扩大了研究结果，学生和教职员工在行业合作伙伴的设施中直接参与，同时满足了要求。该奖项反映了NSF'SF'SF'SFLY Mission，并通过评估获得了值得支持的支持使用Toundation的智力优点和更广泛的影响审查标准。

项目成果

Reactive Extrusion Additive Manufacturing (REAM) of Functionally Graded, Magneto-Active Thermoset Composites

• DOI: 10.1016/j.addma.2023.103486
• 发表时间: 2023-03
• 期刊: Additive Manufacturing
• 影响因子: 11
• 作者: O. Uitz;Rui Leng;Tan Pan;Xiaoyue Zhao;A. Oridate;Carolyn C. Seepersad;Z. Ounaies;M. Frecker

Fast, low-energy additive manufacturing of isotropic parts via reactive extrusion

通过反应挤出快速、低能耗地增材制造各向同性零件

• 发表时间: 2021
• 期刊: Additive manufacturing
• 影响因子: 11
• 作者: Uitz, Oliver;Koirala, P.;Tehrani, M.;Seepersad, C.
• 通讯作者: Seepersad, C.