13th International Conference on the Technology of Plasticity (ICTP 2020); Columbus, Ohio; July 26-31, 2020

第十三届国际可塑性技术会议(ICTP 2020);

基本信息

  • 批准号:
    1951297
  • 负责人:
  • 金额:
    $ 5万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2020
  • 资助国家:
    美国
  • 起止时间:
    2020-01-15 至 2021-12-31
  • 项目状态:
    已结题

项目摘要

This award supports up to 25 students and 15 postdoctoral researchers at US institutions to participate in the Thirteenth International Conference on the Technology of Plasticity (ICTP2020), to be held at The Ohio State University on July 26-31, 2020. The ICTP 2020, sponsored by the Metallurgical Society (TMS). will bring together researchers, professionals, and engineers from around the world to discuss improvements and innovations in all major areas of the technology and science of metal forming. The award provides young researchers with opportunities to exchange ideas with leading researchers and engineers from worldwide industrial and governmental facilities, as well as with students and faculty from both domestic and international engineering schools. In addition to nurturing a global manufacturing vision, participants will learn the latest research areas and results in metal forming. Topical areas at the ICTP2020 will include sessions concerned with traditional fields, such metal forming processes, joining by deformation, and microstructure characterization and development by forming, and will also include a number of sessions on innovative, forward-looking topics, such as the role of Big Data and Artificial Intelligence in metal forming, and the emergence of agile metal forming and high-speed impulse forming techniques and technologies to speed innovations. Requested funds will be used to provide participant support for young researchers. Underrepresented groups will be strongly encouraged to apply and support will be provided to no more than three individuals from any one university or organization to encourage diversity among the institutions represented. In addition, assistance awards will be provided to some invited keynote speakers, to procure supplies needed for the poster session, which is anticipated to draw over 50 early career presenters, and to partially defray the cost of producing and printing the conference proceedings. Attendees will complete a survey to determine the most popular sessions and aspects of the program that will allow future conferences to expand the topic focus or cover new areas that were not explored.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
该奖项为美国机构的多达25名学生和15名博士后研究人员参加了参加第十三届可塑性技术国际会议(ICTP2020),该会议将于2020年7月26日至31日在俄亥俄州立大学举行。冶金学会(TMS)赞助。将汇集来自世界各地的研究人员,专业人士和工程师,讨论金属形成技术和科学所有主要领域的改进和创新。该奖项为年轻的研究人员提供了与全球工业和政府设施的领先研究人员和工程师以及国内和国际工程学校的学生和教职员工交流思想的机会。除了培养全球制造愿景外,参与者还将学习最新的研究领域,并导致金属形成。 ICTP2020的主题领域将包括与传统领域有关的会议,此类金属形成过程,通过变形加入以及微观结构的表征和开发,还将包括许多有关创新,前瞻性主题的会话,例如角色金属形成中的大数据和人工智能,以及敏捷金属形成和高速冲动形成技术和技术的出现,以加快创新。要求的资金将用于为年轻研究人员提供参与者的支持。 强烈鼓励代表性不足的团体申请,并向任何一所大学或组织的三个人提供支持,以鼓励所代表的机构之间的多样性。此外,还将向一些受邀的主题演讲者提供援助奖,以获取海报会议所需的供应,预计将吸引50多名早期职业演示者,并部分支付制作和印刷会议会议记录的成本。 与会者将完成一项调查,以确定该计划最受欢迎的会议和各个方面,这将使未来的会议能够扩大主题重点或涵盖未探索的新领域。该奖项反映了NSF的法定任务,并被视为值得通过评估的支持。利用基金会的知识分子和更广泛的影响审查标准。

项目成果

期刊论文数量(1)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
Forming the Future 2021 ICTP
塑造未来 2021 ICTP
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Michael Rawlings其他文献

Michael Rawlings的其他文献

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{{ truncateString('Michael Rawlings', 18)}}的其他基金

Conference: Participant Support for The 7th World Congress on Integrated Computational Materials Engineering (ICME); Orlando, Florida; 21-25 May 2023
会议:第七届世界集成计算材料工程大会(ICME)与会者支持;
  • 批准号:
    2316628
  • 财政年份:
    2023
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
Conference: The 6th World Congress on Integrated Computational Materials Engineering (ICME)
会议:第六届世界集成计算材料工程大会(ICME)
  • 批准号:
    2225707
  • 财政年份:
    2022
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
Support for Participation of US Students to the 11th International Conference on Porous Metals and Metallic Foams (MetFoam 2019); Dearborn, Michigan; August 20-23, 2019
支持美国学生参加第十一届多孔金属和金属泡沫国际会议(MetFoam 2019);
  • 批准号:
    1932762
  • 财政年份:
    2019
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant
Conference: 5th World Congress on Integrated Computational Materials Engineering (ICME); Indianapolis, Indiana; July 21-25, 2019
会议:第五届世界集成计算材料工程大会(ICME);
  • 批准号:
    1929228
  • 财政年份:
    2019
  • 资助金额:
    $ 5万
  • 项目类别:
    Standard Grant

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