SaTC: EDU: Collaborative: An Educational Initiative on Cybersecurity in Additive Manufacturing

SaTC：EDU：协作：增材制造网络安全教育计划

• 批准号: 1931724
• 负责人: Nikhil Gupta
• 金额: $ 46.4万
• 依托单位: New York University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2019
• 资助国家: 美国
• 起止时间: 2019-10-01 至 2023-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1931724&HistoricalAwards=false
• 关键词: SaTC; EDU; Collaborative; Educational; Initiative

Additive manufacturing (AM), widely known as 3D printing, is the process of making three dimensional objects from a digital file. AM is enabling product innovation in a wide range of fields including automobiles, aircraft, spacecraft, toys, consumer products, food and medical implants and devices. A 3D printer is now located on the International Space Station to print parts on demand. Such high-value parts are designed by making extensive use of design, simulation and analysis tools, including high-performance computing, and make use of cloud-based resources throughout the process chain. In this project, New York University (NYU) is partnering with New York City College of Technology (City Tech) to educate students and to engage a wide range of stakeholders as the project builds capacity in the emerging field of AM security. The project will first develop an introductory graduate level course on AM security to be taught at both schools. This course will be part of a new Master of Science program and a new certificate program, both in AM. An on-line version of the course will also be offered. Complementing the course, the project will organize the HACK3D hackathon to build the security mindset of students for approaching digital manufacturing. In addition, the project will start an annual workshop and undergraduate summer research program in innovative research on the cybersecurity of digital manufacturing.The educational framework in this project will be first of its kind to address the security challenge in AM field by a collaborative team of a mechanical engineer and a computer science cybersecurity expert. The NYU team has pioneered the AM attack taxonomy and design-based security scheme that are the core areas of this project. The security scheme requires a collaborative approach because innovative design features are embedded in the 3D solid models and extensively tested for possible breaches according to the proposed taxonomy of threats. The interdisciplinary framework by this project enables the creation of a cross-disciplinary course on cybersecurity in AM. The associated educational and continuing resources will prepare many undergraduates and graduate students as well as working professionals in cybersecurity in AM.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

添加剂制造（AM）（广泛称为3D打印）是从数字文件中制作三维对象的过程。 AM正在启用产品创新，包括汽车，飞机，航天器，玩具，消费品，食品和医疗植入物和设备，包括汽车，飞机，飞船，玩具，消费品。现在，3D打印机位于国际空间站，以按需打印零件。这样的高价值零件是通过广泛使用设计，仿真和分析工具（包括高性能计算）以及在整个过程链中利用基于云的资源来设计的。在该项目中，纽约大学（NYU）正在与纽约市理工学院（城市技术）合作，以教育学生并参与广泛的利益相关者，因为该项目在AM Security的新兴领域建立了能力。该项目将首先开发一门关于AM Security的介绍性研究生级课程，以在两所学校进行教授。本课程将成为新的科学硕士课程和新证书计划的一部分。还将提供该课程的在线版本。在课程中，该项目将组织Hack3D Hackathon，以建立学生接近数字制造的安全心态。此外，该项目将在数字制造业网络安全方面启动年度研讨会和本科夏季研究计划。该项目的教育框架将首先通过机械工程师和计算机科学网络专家的协作团队的协作团队来解决AM Field的安全挑战。纽约大学团队率先开创了AM攻击分类法和基于设计的安全计划，该计划是该项目的核心领域。安全计划需要一种协作方法，因为创新的设计功能嵌入了3D固体模型中，并根据拟议的威胁分类法进行了广泛的测试，以实现可能的破坏。该项目的跨学科框架可以创建有关AM网络安全的跨学科课程。相关的教育和持续资源将为许多本科生和研究生以及AM的网络安全工作人员做好准备。该奖项反映了NSF的法定任务，并被认为是值得通过基金会的知识分子优点和更广泛影响的评估审查标准来通过评估来获得支持的。

项目成果

Cybersecurity Road Map for Digital Manufacturing

数字化制造的网络安全路线图

• DOI: 10.1109/mc.2020.3003432
• 发表时间: 2020
• 期刊: Computer
• 影响因子: 2.2
• 作者: Tsoutsos, Nektarios Georgios;Gupta, Nikhil;Karri, Ramesh
• 通讯作者: Karri, Ramesh

In-process thermal imaging to detect internal features and defects in fused filament fabrication

过程中热成像可检测熔丝制造中的内部特征和缺陷

• DOI: 10.1007/s00170-023-12535-2
• 发表时间: 2023
• 期刊: The International Journal of Advanced Manufacturing Technology
• 作者: AbouelNour, Youssef;Gupta, Nikhil
• 通讯作者: Gupta, Nikhil

Hack3D: Crowdsourcing the Assessment of Cybersecurity in Digital Manufacturing

Hack3D：众包数字制造中的网络安全评估

• DOI: 10.1109/mc.2021.3074192
• 发表时间: 2021
• 期刊: Computer
• 影响因子: 2.2
• 作者: Linares, Michael;Aswani, Nishant;Mac, Gary;Jin, Chenglu;Chen, Fei;Gupta, Nikhil;Karri, Ramesh
• 通讯作者: Karri, Ramesh

Artificial Neural Networks Framework for Detection of Defects in 3D-Printed Fiber Reinforcement Composites

用于检测 3D 打印纤维增强复合材料缺陷的人工神经网络框架

• DOI: 10.1007/s11837-021-04708-9
• 发表时间: 2021
• 期刊: JOM
• 影响因子: 2.6
• 作者: Chen, Guan Lin;Yanamandra, Kaushik;Gupta, Nikhil
• 通讯作者: Gupta, Nikhil

Application of micro-computed tomography for authentication of 3D printed composite parts

微型计算机断层扫描在 3D 打印复合材料零件认证中的应用

• DOI: 10.1016/j.addlet.2022.100104
• 发表时间: 2022
• 期刊: Additive Manufacturing Letters
• 作者: Mac, Gary;Mandal, Meenakshi;Rastogi, Aryan;Gailani, Gaffar;Pearce, Hammond;Gupta, Nikhil
• 通讯作者: Gupta, Nikhil