SHF: Small: Testing and Design-for-Test Techniques for Monolithic 3D Integrated Circuits

SHF：小型：单片 3D 集成电路的测试和测试设计技术

• 批准号: 1908045
• 负责人: Krishnendu Chakrabarty
• 金额: $ 50万
• 依托单位: Duke University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2019
• 资助国家: 美国
• 起止时间: 2019-10-01 至 2023-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1908045&HistoricalAwards=false
• 关键词: SHF; Small; Testing; Design; Test

Fabrication of high-performance integrated circuits is relying increasingly on three-dimensional (3D) integration based on through-silicon vias (TSVs). However, fabrication constraints restrict the integration density that can be achieved using this technology. A recent innovation called Monolithic 3D (M3D) integration has the potential to achieve higher device density and performance compared to 3D stacking based on TSVs. This project seeks to develop efficient ways to test M3D-based integrated circuits, by targeting testing and 'design-for-test' (DfT) methods. Advances in testing and DfT will enable high reliability and low defective-parts-per million, which will enhance the competitiveness of US semiconductor companies. Synergies between research on testing of M3D and on design tools and fabrication will foster a community of researchers and lead to further advances in M3D integration. High-school students from the North Carolina School of Science and Mathematics will be mentored though projects in this space. The outreach plan includes engagement with the Duke Technology Scholars Program, which targets women undergraduates early in their careers. The anticipated outcomes of this research are methodologies and tools to analyze, model, and screen manufacturing defects, as well as DfT solutions to enable testing, defect isolation, and yield enhancement. Research on testing and DfT for M3D is not only timely, but it is likely to find easy acceptance owing to zero legacy, and can therefore have a dramatic impact on research and industry practice.Specific research goals in this project include the following: (1) A built-in self-test (BIST) solution to detect and diagnose faults in inter-layer vias (ILVs) and the reuse of this BIST infrastructure for detecting faults in logic and memory tiers. (2) Design of BIST controllers for coordinating test application. (3) Test generation for delay faults introduced by device coupling in M3D, and defects in ILVs and the inter-layer dielectric. (4) Design of the power-distribution network to increase resilience to the problems of electromigration and stress migration. Close collaborations are underway with partners at leading companies and internationally renowned institutions in this field. Research findings will be integrated in VLSI design and testing courses at Duke and lecture materials will be made available to the broader community.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

高性能集成电路的制造越来越依赖基于硅通孔 (TSV) 的三维 (3D) 集成。然而，制造限制限制了使用该技术可以实现的集成密度。与基于 TSV 的 3D 堆叠相比，最近一项称为单片 3D (M3D) 集成的创新有可能实现更高的器件密度和性能。该项目旨在通过目标测试和“测试设计”(DfT) 方法，开发有效的方法来测试基于 M3D 的集成电路。测试和 DfT 的进步将实现高可靠性和低百万分之一缺陷率，这将增强美国半导体公司的竞争力。 M3D 测试与设计工具和制造研究之间的协同作用将培育研究人员社区，并推动 M3D 集成的进一步发展。来自北卡罗来纳州科学与数学学院的高中生将通过该领域的项目获得指导。外展计划包括参与杜克大学技术学者计划，该计划针对职业生涯早期的女本科生。这项研究的预期成果是分析、建模和筛选制造缺陷的方法和工具，以及支持测试、缺陷隔离和产量提高的 DfT 解决方案。 M3D 测试和 DfT 的研究不仅是及时的，而且由于零遗留而很容易被接受，因此可以对研究和行业实践产生巨大影响。该项目的具体研究目标包括以下内容：（1 ) 内置自测试 (BI​​ST) 解决方案，用于检测和诊断层间过孔 (ILV) 中的故障，并重用此 BIST 基础设施来检测逻辑和内存层中的故障。 (2) 设计用于协调测试应用的BIST控制器。 (3) M3D 中器件耦合引入的延迟故障以及 ILV 和层间电介质缺陷的测试生成。 (4) 配电网络的设计，以提高对电迁移和应力迁移问题的抵御能力。我们正在与该领域的领先公司和国际知名机构的合作伙伴进行密切合作。 研究成果将被纳入杜克大学的 VLSI 设计和测试课程中，并且讲座材料将向更广泛的社区提供。该奖项反映了 NSF 的法定使命，并通过使用基金会的智力价值和更广泛的影响审查标准进行评估，被认为值得支持。

项目成果

Built-in Self-Test and Fault Localization for Inter-Layer Vias in Monolithic 3D ICs

单片 3D IC 中层间过孔的内置自测试和故障定位

• DOI: 10.1145/3464430
• 发表时间: 2022
• 期刊: ACM Journal on Emerging Technologies in Computing Systems
• 影响因子: 2.2
• 作者: Chaudhuri, Arjun;Banerjee, Sanmitra;Kim, Jinwoo;Park, Heechun;Ku, Bon Woong;Kannan, Sukeshwar;Chakrabarty, Krishnendu;Lim, Sung Kyu
• 通讯作者: Lim, Sung Kyu

Advances in Testing and Design-for-Test Solutions for M3D Integrated Circuits

M3D 集成电路测试和测试设计解决方案的进展

• DOI: 10.23919/date51398.2021.9473921
• 发表时间: 2021
• 期刊: Automation and Test in Europe (DATE
• 作者: Banerjee, Sanmitra;Chaudhuri, Arjun;Hung, Shao-Chun;Chakrabarty, Krishnendu
• 通讯作者: Chakrabarty, Krishnendu

Power Supply Noise-Aware At-Speed Delay Fault Testing of Monolithic 3-D ICs

单片 3D IC 的电源噪声感知全速延迟故障测试

• DOI: 10.1109/tvlsi.2021.3108787
• 发表时间: 2021
• 期刊: IEEE Transactions on Very Large Scale Integration (VLSI
• 作者: Hung, Shao-Chun;Lu, Yi-Chen;Lim, Sung Kyu;Chakrabarty, Krishnendu
• 通讯作者: Chakrabarty, Krishnendu

NodeRank: Observation-Point Insertion for Fault Localization in Monolithic 3D ICs ∗

NodeRank：单片 3D IC 中故障定位的观察点插入 —

• DOI: 10.1109/ats49688.2020.9301589
• 发表时间: 2020
• 期刊: IEEE Asian Test Symposium
• 作者: Chaudhuri, Arjun;Banerjee, Sanmitra;Chakrabarty, Krishnendu
• 通讯作者: Chakrabarty, Krishnendu

Design of a Reliable Power Delivery Network for Monolithic 3D ICs *

单片 3D IC 的可靠供电网络设计 *

• DOI: 10.23919/date48585.2020.9116570
• 发表时间: 2020
• 期刊: Automation & Test in Europe Conference & Exhibition (DATE
• 作者: Hung, Shao-Chun;Chakrabarty, Krishnendu
• 通讯作者: Chakrabarty, Krishnendu