Elastocaloric TiNi-based Films and Devices

弹热 TiNi 基薄膜和器件

• 批准号: 226996689
• 负责人: Professor Dr. Manfred Kohl
• 金额: --
• 依托单位: Institut für Mikrostrukturtechnik (IMT)
• 依托单位国家: 德国
• 项目类别: Priority Programmes
• 财政年份: 2012
• 资助国家: 德国
• 起止时间: 2011-12-31 至 2018-12-31
• 项目状态: 已结题
• 来源: https://gepris.dfg.de/gepris/projekt/226996689?language=en
• 关键词: Elastocaloric; TiNi; based; Films; Devices; Elastocaloric; TiNi; based; Films; Devices

This proposal represents the renewal of the joint project 'Elastocaloric Ti-Ni based Films and Devices' aiming at solid-state cooling using TiNi-based shape memory films. During the first funding period we demonstrate that SMA film devices show large temperature changes up to -16 K, high cycling frequencies faster than 1 Hz as well as ultra-high fatigue resistance (> 10 million cycles). These properties will be further explored in innovative cooling devices using the potential of thin film and MEMS technology. The underlying mechanisms for long term stability are investigated by focusing on the influence of precipitates, austenite/martensite crystallographic compatibility and grain size (E. Quandt). The results are then transferred to other material systems by investigating elastocaloric effect size and efficiency to identify well suited materials for small-scale elastocaloric cooling applications. Two approaches in demonstrator development are pursued based either on solid/solid heat transfer or on heat transfer in a liquid medium (M. Kohl). Solid/solid heat transfer will be improved by adapting the shape and force of contacting surfaces as well as by investigating the influence of thermally conductive layers and surface topography due to micro/nano-machining. Heat transfer in a liquid medium will be investigated for a regeneration-based elastocaloric device. Finite element simulations are performed on the device level taking into account the thermo-mechanical coupling of SMA film device and its environment. Demonstrator systems (M. Kohl and E. Quandt) will be fabricated and evaluated with respect to cooling power and long-term operation. The potential for microcooling applications will be assessed for the case of a lab-on-chip system.

该提案代表了联合项目的“基于Ti-ni的弹性膜和设备”的续约，该胶片和设备旨在使用基于Tini的形状记忆膜进行固态冷却。在第一个融资期间，我们证明SMA膜设备显示出较大的温度变化高达-16 K，高循环频率比1 Hz快速变化，并且超高疲劳阻力（> 1000万个循环）。这些属性将在创新的冷却设备中进一步探索，使用薄膜和MEMS技术的潜力。长期稳定性的基本机制是通过关注沉淀物，奥斯丁岩/马氏体晶体学兼容性和晶粒尺寸的影响来研究的（E. Quandt）。然后，通过研究弹性效应的大小和效率，将结果转移到其他材料系统中，以确定适合小型弹性冷却应用的材料。基于固体/固体传热或液体培养基（M. KOHL）中的传热方法，采用了两种方法。通过调整接触表面的形状和力以及通过微电导层和表面形貌的影响，可以改善固体/实心传热。将研究基于再生的弹性装置的液体培养基中的传热。考虑到SMA膜设备及其环境的热机械耦合，在设备级别上进行有限元模拟。示威者系统（M. Kohl和E. Quandt）将在冷却能力和长期操作方面进行制造和评估。对于实验室芯片系统的情况，将评估微动应用的潜力。