STTR Phase I: Spatially controlled direct transfer printing of semiconductor components for high-performance flexible electronic devices

STTR第一阶段：用于高性能柔性电子设备的半导体元件的空间控制直接转移印刷

• 批准号: 1521450
• 负责人: David Grierson
• 金额: $ 22.5万
• 依托单位: SysteMECH, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2015
• 资助国家: 美国
• 起止时间: 2015-07-01 至 2016-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1521450&HistoricalAwards=false
• 关键词: STTR; Phase; Spatially; controlled; direct

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I is the development of a disruptive manufacturing technology that will enable a new class of nanomembrane-based electronic devices to be assembled and integrated on flexible substrates. This innovative technology promises to provide flexible electronics developers and manufacturers a new option for fabricating a wide range of flexible devices that require the integration of high-performance semiconductors. It is anticipated that printing tools and processes based on this core technology will significantly lower the technological barriers that are hindering the widespread manufacture of next-generation flexible devices.This Small Business Innovation Research (SBIR) Phase I project aims to develop a direct printing tool that surpasses the available technologies in terms of both precision and scalability. Current flexible device manufacturing processes do not have the capabilities needed to realize high-performance flexible devices through the integration of high-quality semiconductor materials. Therefore, new strategies are required for fabricating and printing the thin device layers that are essential in emerging high-performance flexible electronics. This project will involve mechanics simulations,tool design and fabrication, process experiments to meet resolution and yield metrics, and establishment of design constraints and operating conditions for a manufacturing process.

这项小型企业创新研究（SBIR）I期的更广泛的影响/商业潜力是一种破坏性制造技术的开发，它将使新的基于纳米桥的电子设备能够组装并集成在柔性基质上。这项创新的技术有望为灵活的电子开发人员和制造商提供一种新的选择，用于制造各种灵活的设备，这些设备需要集成高性能的半导体。可以预料，基于此核心技术的印刷工具和流程将大大降低阻碍下一代灵活设备广泛制造的技术障碍。这项小型企业创新研究（SBIR）I阶段项目旨在开发直接打印工具，以开发一种可在精确和可扩展性方面超过可用技术的直接印刷工具。当前的灵活设备制造工艺没有通过集成高质量的半导体材料来实现高性能灵活设备所需的功能。因此，制造和打印在出现高性能柔性电子产品中必不可少的薄设备层所需的新策略。该项目将涉及力学模拟，工具设计和制造，过程实验以满足分辨率和收益指标，以及建立制造过程的设计约束和操作条件。