Travel Support For ACM/IEEE International Conference on Software Engineering (ICSE 2014)

ACM/IEEE 软件工程国际会议 (ICSE 2014) 差旅支持

• 批准号: 1360923
• 负责人: Mark Grechanik
• 金额: $ 2万
• 依托单位: University of Illinois at Chicago
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2014
• 资助国家: 美国
• 起止时间: 2014-02-01 至 2015-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1360923&HistoricalAwards=false
• 关键词: Travel; Support; ACM; IEEE; International

This grant funds student travel to the International Conference on Software Engineering (ICSE 2014), to be held in June 2014 in Hyderabad, India. This is the flagship conference in the Software Engineering field for researchers, practitioners and educators to present and discuss the most recent innovations, trends, experiences, etc. Funding for student travel has significant broader impacts because of the the opportunity it gives the students to become part of the research community, discuss their research with others, meet leaders in the field, and have experiences toward building the future, global workforce. The funds are for US-based students with attention to broadening participation from underrepresented groups.

这笔赠款资助了学生前往2014年6月在印度海得拉巴举行的国际软件工程会议（ICSE 2014）。这是软件工程领域的旗舰会议，供研究人员，从业人员和教育工作者介绍和讨论最新的创新，趋势，经验等。学生旅行的资金具有更大的影响，因为它给学生提供了机会研究界的一部分，与他人讨论他们的研究，会见该领域的领导者，并具有建立未来的经验，全球劳动力。这些资金是针对美国学生的，他们关注了代表性不足的群体的参与。