Collaborative Research: Laser-driven Micro-Transfer Printing

合作研究：激光驱动微转移印刷

• 批准号: 1300846
• 负责人: YongGang Huang
• 金额: $ 10万
• 依托单位: Northwestern University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2013
• 资助国家: 美国
• 起止时间: 2013-06-01 至 2016-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1300846&HistoricalAwards=false
• 关键词: Collaborative; Research; Laser; driven; Micro

The research objective of this award is to develop a new manufacturing process, Laser-driven Micro-Transfer Printing (LMTP), that enables the facile transfer of conventionally fabricated micro- and nanostructures from their handle or growth substrate to a functional substrate. It exploits the difference in the response of a printable (microstructure) ink and the stamp carrying it to a laser pulse to create a thermal mismatch strain at the stamp-ink interface. This energy stored in this mismatch strain drives the release of the ink from the stamp and its transfer to a receiving substrate. Using experimental observations and computational modeling, this research will seek to understand and characterize the thermo-mechanical phenomena involved in the process. This knowledge will be used to optimize the process elements (e.g., transfer stamp geometry and material) and parameters to allow for low-temperature, robust process behavior. Project deliverables include published models, knowledge and characterization of the LMTP process, a computerized manufacturing tool with an instrumented print head for the LMTP process, demonstrations of three-dimensional integrated circuit (3-D IC) packaging and printed multi-layer micro-electromechanical systems (MEMS), engineering student education, and engineering research experiences for undergraduate students.If successful, the project will provide a facile and efficient manufacturing pathway for realizing material-scale heterogeneous functional integration ? the controlled inserting of microscopic functional devices at the precise locations of the desired function. This type of capability is critical to emerging technologies such as flexible electronics, 3-D IC packaging and integrated micro-electromechanical systems. Graduate and undergraduate engineering students will benefit through classroom modules developed within this project as well as through involvement in the research. Efforts to motivate high school students to science, technology, engineering and mathematics (STEM) careers will benefit from the contributions that this project will make to high-school summer camps.

该奖项的研究目标是开发一种新的制造工艺，即激光驱动的微转移印刷（LMTP），该工艺能够将传统制造的微米和纳米结构从其手柄或生长基底轻松转移到功能基底上。它利用可印刷（微结构）墨水和承载该墨水的印模对激光脉冲的响应差异，在印模-墨水界面处产生热失配应变。这种失配应变中存储的能量驱动墨水从印模中释放并转移到接收基材上。这项研究将利用实验观察和计算模型来理解和表征该过程中涉及的热机械现象。这些知识将用于优化工艺元素（例如，转移印模几何形状和材料）和参数，以实现低温、稳健的工艺行为。项目可交付成果包括已发布的 LMTP 工艺模型、知识和特性、带有用于 LMTP 工艺的仪表化打印头的计算机化制造工具、三维集成电路 (3-D IC) 封装和印刷多层微机电演示如果成功，该项目将为实现材料尺度异构功能集成提供便捷高效的制造途径？将微型功能装置受控地插入到所需功能的精确位置。这种能力对于柔性电子、3D IC 封装和集成微机电系统等新兴技术至关重要。工程专业的研究生和本科生将通过该项目开发的课堂模块以及参与研究而受益。激励高中生从事科学、技术、工程和数学 (STEM) 职业的努力将受益于该项目对高中夏令营的贡献。