Measuring Thermomechanical Material Response During Micromachining by In Situ Scanning Electron Microscopy

通过原位扫描电子显微镜测量微加工过程中的热机械材料响应

• 批准号: 0856626
• 负责人: M Ravi Shankar
• 金额: $ 32.54万
• 依托单位: University of Pittsburgh
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2009
• 资助国家: 美国
• 起止时间: 2009-09-01 至 2014-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0856626&HistoricalAwards=false
• 关键词: Measuring; Thermomechanical; Material; Response; During

The objective of this research is to elucidate the deformation mechanics of chip formation in micromachining using in situ scanning electron microscopy. In this study, metal cutting will be performed on a customized sub-stage within the sample chamber of a scanning electron microscope in a configuration that enables direct visualization and characterization of the deformation zone in secondary and backscattered electron imaging modes. Subsequently, the mechanics of deformation will be delineated in situ through digital image correlation of sequences of secondary electron micrographs of the micromachining process. The microstructural consequences of micrometer-scale surface generation will be studied using electron backscattered diffraction techniques. Together, these characterizations can enable a detailed demarcation of the thermomechanical material response during material removal at small length-scales.If successful, this research may significantly enhance the current level of understanding of the micromachining process and possibly supplant the extant experimental paradigms which offer at best, a post-deformation, ex situ scheme entirely devoid of the dynamic details of the operative micromechanisms. It is envisioned that the interdisciplinary framework inherent to this research may offer unique opportunities for multi-faceted development of graduate students by bringing together elements of vacuum device design, quantitative electron microscopy as well as computational image processing methodologies. An impact on advancing undergraduate education is envisaged via integration with existing courses in manufacturing and creation of a new course aimed at seniors and juniors in the Industrial, Mechanical and Materials Science disciplines.

这项研究的目的是阐明使用原位扫描电子显微镜在微加工中芯片形成的变形力学。在这项研究中，将在扫描电子显微镜的样品室内的定制子阶段进行金属切割，该构型以二次和反向散射电子成像模式的变形区的直接可视化和表征进行直接可视化和表征。随后，将通过微加工过程的次级电子显微照片序列的数字图像相关性来原位对变形的力学进行定位。将使用电子反向散射技术研究微米尺度表面产生的微观结构后果。这些特征共同可以在较小的长度尺度上取消材料的过程中对热机械材料响应的详细划分。如果成功，这项研究可能会大大提高对微加工过程的当前了解水平，并可能取代了实验性的实验范式，这些范式最佳地提供了最佳的，即最终的实现后，则完全详细介绍了该动态详细信息，该机构是动态详细范围的。可以预见的是，这项研究固有的跨学科框架可以通过将真空设备设计，定量电子显微镜以及计算图像处理方法汇总在一起，为研究生的多方面发展提供独特的机会。通过与现有的制造业和创建针对工业，机械和材料科学学科中的老年人和大三学生的新课程的课程相结合来设想对前进的本科教育的影响。