SBIR Phase I: Micro-Compliant-Interconnect-Mechanisms (MCIMs)

SBIR 第一阶段：微兼容互连机制 (MCIM)

基本信息

批准号：
0810548
负责人：
David Bloom
金额：
$ 10万
依托单位：
ALCES TECHNOLOGY, INC.
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
2008
资助国家：
美国
起止时间：
2008-07-01 至 2008-12-31
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=0810548&HistoricalAwards=false
关键词：
SBIR Phase Micro Compliant Interconnect

项目摘要

This Small Business Innovation Research Phase I research project investigates the feasibility of using Micro-Compliant-Interconnect-Mechanisms (MCIMs) to provide chip level communication to Micro-Electro-Mechanical-Systems (MEMS) devices. MCIMs are microscopic spring connectors fabricated directly on silicon wafers which provide an alternative to soldered flip chip technology for interconnecting individual dies in multi chip modules. Evolving MEMS designs have led to increasingly high-density devices. Providing reliable inter-die electrical interconnections to high density MEMS represents a substantial portion of the overall complexity of these devices. The MCIM connection technology described in this project offers to dramatically reduce the cost of packaged MEMS devices making them available to a much broader market. The broader impact of this technology is that MCIMs represent a novel solution to the challenge of providing high density inter-die electrical connections in devices utilizing multi-chip module architectures. The higher yields and lower production costs provided by MCIMs will lead to new market opportunities for MEMS based laser light modulators. The high costs and relatively low per wafer yields of these devices restrict their use to high end markets. Other applications of MCIMs include the development of micro-probes for use in semiconductor testing.

该小型企业创新研究第一阶段研究项目研究了使用微兼容互连机制 (MCIM) 为微机电系统 (MEMS) 设备提供芯片级通信的可行性。 MCIM 是直接在硅晶圆上制造的微型弹簧连接器，它提供了焊接倒装芯片技术的替代方案，用于互连多芯片模块中的各个芯片。不断发展的 MEMS 设计导致设备密度越来越高。为高密度 MEMS 提供可靠的管芯间电互连代表了这些器件总体复杂性的很大一部分。该项目中描述的 MCIM 连接技术可大幅降低封装 MEMS 设备的成本，使其能够进入更广阔的市场。该技术更广泛的影响在于，MCIM 代表了一种新颖的解决方案，可应对在利用多芯片模块架构的设备中提供高密度芯片间电气连接的挑战。 MCIM 提供的更高产量和更低生产成本将为基于 MEMS 的激光调制器带来新的市场机会。这些器件的高成本和相对较低的每晶圆产量限制了它们在高端市场的使用。 MCIM 的其他应用包括开发用于半导体测试的微型探针。