Design Methodologies and Algorithms for Three-Dimensional Integrated Systems

三维集成系统的设计方法和算法

• 批准号: 0541206
• 负责人: Eby Friedman
• 金额: $ 27.5万
• 依托单位: University of Rochester
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-06-15 至 2010-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0541206&HistoricalAwards=false
• 关键词: Design; Methodologies; Algorithms; Three; Dimensional

CCF-0541206 PI: Friedman, Eby G. Institution: University of Rochester Title: Design Methodologies and Algorithms for Three-Dimensional Integrated Systems AbstractThe introduction of the integrated circuit (IC) has led the electronics market to unprecented growth over the past several decades. This rate of growth has to date been leveraged by the semiconductor industry scaling the size of the transistors of the circuits. This scaling has delivered systems with higher performance and greater functional capabilities. The increase in integration density however cannot continue due to several limitations, both physical and technological. The focus of research in the IC design community has, therefore, been dedicated to the development of design methodologies that will provide effective solutions to predicted challenges in the design of future integrated circuits.An emerging design paradigm is that of three-dimensional integration, where the third dimension is utilized for additional circuitry. With the third dimension, the distance between neighboring circuits is greatly reduced, improving the performance as well as the density of the system. A straightforward analogy from our daily lives can be described; the walking distance between two neighboring building is almost always longer than the distance between two neighboring floors in a high rise building.In this research project, important design issues related to 3-D systems are investigated in order to advance and proliferate the knowledge in this promising technology. This project emphasizes three critical issues for the reliable design of integrated circuits:Developing design methodologies to synchronize the operation of circuits across each layer and among the layers making up the 3-D structure.Providing design strategies to efficiently deliver the required power for the robust operation of the circuits on each layer of the 3-D system.The development of techniques that support the undistorted propagation of signals throughout the 3-D system. This task has become particularly challenging due to device scaling, since the closer the devices are to each other, the greater the interference between the signals.These methodologies will be applied to various circuits, and prototypes will be fabricated to demonstrate the efficacy and limitations of the proposed design techniques and methodologies.

CCF-0541206 PI：Friedman, Eby G. 机构：罗切斯特大学 标题：三维集成系统的设计方法和算法 摘要 在过去的几十年中，集成电路 (IC) 的引入导致电子市场出现了前所未有的增长。迄今为止，半导体行业已经利用了这种增长率来扩大电路晶体管的尺寸。这种扩展提供了具有更高性能和更强大功能的系统。然而，由于物理和技术方面的一些限制，集成密度的增加无法持续下去。因此，IC 设计界的研究重点一直致力于设计方法的开发，这些方法将为未来集成电路设计中的预测挑战提供有效的解决方案。一种新兴的设计范式是三维集成，其中第三维用于附加电路。通过第三维，相邻电路之间的距离大大缩短，从而提高了系统的性能和密度。可以用我们日常生活中的一个简单的类比来描述：两栋相邻建筑物之间的步行距离几乎总是比高层建筑中两栋相邻楼层之间的距离长。在这个研究项目中，研究了与 3D 系统相关的重要设计问题，以推进和扩散这方面的知识有前途的技术。该项目强调了集成电路可靠设计的三个关键问题：开发设计方法，以同步各层以及构成 3D 结构的各层之间的电路操作。提供设计策略，以有效地提供鲁棒性所需的功率。 3D 系统每一层电路的操作。支持信号在整个 3D 系统中不失真传播的技术的发展。由于器件尺寸缩小，这项任务变得特别具有挑战性，因为器件彼此距离越近，信号之间的干扰就越大。这些方法将应用于各种电路，并且将制造原型来展示其功效和局限性提出的设计技术和方法。