CAREER: Novel Environmentally-Benign Solders for Electronic Packaging: Thermomechanical Behavior and Characterization

职业：用于电子封装的新型环保焊料：热机械行为和表征

• 批准号: 0092530
• 负责人: Nikhilesh Chawla
• 金额: --
• 依托单位: Arizona State University
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2001
• 资助国家: 美国
• 起止时间: 2001-02-01 至 2008-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0092530&HistoricalAwards=false
• 关键词: CAREER; Novel; Environmentally; Benign; Solders

0092530Chawla This CAREER program examines novel, environmentally benign solders in bulk form and at small length scales. The research plan includes experimental investigations coupled with computational modeling of the mechanical behavior and microstructure of promising Pb-Sn solder replacement alloys (Sn-Cu, Sn-Ag, and Sn-Ag-Cu). The role of evolution of microstructure, including coarsening of the solder microstructure and solder/substrate interactions, is examined with respect to the creep and thermal fatigue behavior. The evolution of microstructure is modeled using the novel, microstructure-integrated, Object Oriented Finite Element Method (OOF), recently developed at the National Institute for Standards and Technology (NIST). Novel micromechanical testing techniques will be developed to characterize thermomechanical behavior at the solder ball level. Conventional FEM techniques, using accurately measured constitutive behavior derived from micromechanical testing, will be used to develop life prediction methodologies. In addition, an outreach program will be implemented through the Office for Minority Engineering Students (OMEP) and the Women in Science and Engineering (WISE) program at Arizona State University. High school teachers will spend a summer in the PI's laboratory to gain experience with cutting edge research. Also, part-time students from industry will take part in new and revised courses dealing with the subject of materials for electronic packaging, including physical and mechanical metallurgy of solders. %%%Given the widespread use of Pb-Sn solder in the manufacture and assembly of circuit boards, the development and reliability of new Pb-free solders is crucial for the successful substitution of these materials in the electronic systems. The subject of Pb-free solders is of great interest to local companies such as Intel, Motorola, and Onsemiconductor and close interaction with industry is expected throughout the course of this career development program. It is believed that the education outreach effort will contribute to an increase in the number of undergraduate students majoring in materials science. This is particularly important given the high demand for engineers with materials backgrounds in the microelectronic packaging industry. ***

0092530Chawla这个职业计划研究了小说，以散装形式和小规模的环境良性焊料。该研究计划包括实验研究，结合有希望的PB-SN焊料替换合金（SN-CU，SN-AG和SN-AG-CU）的机械行为和微观结构的计算模型。相对于蠕变和热疲劳行为，研究了微观结构演变的作用，包括焊料微结构和焊料/底物相互作用的作用。微观结构的演变是使用新颖的，微结合的，面向对象的有限元法（OOF）建模的，该方法最近在美国国家标准技术研究所（NIST）开发。 将开发新型的微力学测试技术来表征焊球水平的热机械行为。传统的FEM技术使用从微机械测试中得出的准确测量的构型行为，将用于开发生活预测方法。 此外，亚利桑那州立大学的少数族裔工程专业学生（OMEP）和科学与工程学妇女（WISE）计划将实施外展计划。 高中老师将在PI的实验室度过一个夏天，以获得尖端研究的经验。 此外，来自行业的兼职学生将参加针对电子包装材料的新课程和经过修订的课程，包括焊料的物理和机械冶金。考虑到PB-SN焊料在电路板的制造和组装中广泛使用，新的无PB焊料的开发和可靠性对于在电子系统中成功替换这些材料至关重要。无PB焊料的主题引起了本地公司，例如英特尔，摩托罗拉和血管直导，以及在整个职业发展计划的整个过程中都有预计与行业的密切互动。人们认为，教育外展工作将有助于增加材料科学专业的本科生数量。鉴于对微电子包装行业具有材料背景的工程师的需求很高，这一点尤其重要。 ***