GOALI/IUCP: Testing and Constitutive Modeling of Joining Materials for Design and Reliability in Electronic Packaging

GOALI/IUCP：电子封装设计和可靠性连接材料的测试和本构建模

• 批准号: 9812696
• 负责人: Chandra Desai
• 金额: $ 29万
• 依托单位: University of Arizona
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1998
• 资助国家: 美国
• 起止时间: 1998-09-01 至 2002-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9812696&HistoricalAwards=false
• 关键词: GOALI; IUCP; Testing; Constitutive; Modeling

9812696 Desai This Grant Opportunities for Academic Liaison with Industry (GOALI) research project is the continuation of work on an innovative model and test device for electronic packaging. Several new directions will be undertaken in the integration of laboratory testing, constitutive modeling and computer analysis. A new thermomechanical laser interferometry device has been developed and a series of tests will be performed to gain information on the effects on joining materials, including lead-free materials, of variations in cyclic mechanical and thermal loading. This thermomechanical behavior of the material will be incorporated into the unified constitutive modeling approach using the disturbed state concept (DSC). The preliminary work has demonstrated the validity of the model for simple applications on various solders and silicon. This research project will focus upon characterizing the integration of the modeling and testing to permit future optimization of design and reliability analysis methodology. This project addresses the significant need of having a better understanding of reliability in electronic packaging and the impact upon the microelectronics industry.

9812696 Desai 这项资助学术与工业联络机会 (GOALI) 研究项目是电子封装创新模型和测试设备工作的延续。将在实验室测试、本构建模和计算机分析的集成方面开展几个新的方向。一种新的热机械激光干涉测量装置已经开发出来，并将进行一系列测试，以获得有关循环机械和热载荷变化对连接材料（包括无铅材料）影响的信息。材料的这种热机械行为将被纳入使用扰动状态概念 (DSC) 的统一本构建模方法中。 初步工作证明了该模型对于各种焊料和硅的简单应用的有效性。该研究项目将重点关注建模和测试集成的特征，以实现未来设计和可靠性分析方法的优化。 该项目满足了更好地了解电子封装可靠性及其对微电子行业影响的重大需求。