GOALI/IUCP: Subsurface Damage in II-VI Semiconductors

GOALI/IUCP：II-VI 半导体中的次表面损伤

• 批准号: 9713747
• 负责人: Don Lucca
• 金额: $ 21.22万
• 依托单位: Oklahoma State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-09-01 至 2002-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9713747&HistoricalAwards=false
• 关键词: GOALI; IUCP; Subsurface; Damage; II

This university-industry collaboration research project seeks to understand the subsurface damage resulting from ultra-fine finishing processes in the manufacture of wide band-gap semiconductor substrates. This understanding will aid in identifying the processing conditions that can overcome subsurface damage problems in producing these substrates. Substrates of II-VI semiconductor materials including ZnSe, CdS and ZnO will be prepared by a variety of surface processing methods including ultra-precision machining and polishing. The resulting subsurface lattice disorder will be assessed with the use of ion beam channeling, cathodoluminescent, and scanning capacitance microscopy. Subsequent to surface characterization, epitaxial films will be grown on the substrates by molecular beam epitaxy, and will be used to do performance testing. The project will be conducted in collaboration with Eagle-Picher Research Laboratory, Los Alamos National Laboratory, and the National Institute of Standards and Technology. The project can lead to a fundamental understanding of subsurface damage in the ultra-fine finishing of semiconductor substrates, with significant practical benefits in the production of LEDs and lasers among others. A major strength of the project is the existence of strong partnerships with industry and government laboratories.

该大学与工业界合作研究项目旨在了解宽带隙半导体基板制造中超精细精加工工艺造成的表面下损伤。 这种理解将有助于确定可以克服生产这些基材时的表面下损伤问题的加工条件。 包括ZnSe、CdS和ZnO在内的II-VI族半导体材料的衬底将通过包括超精密加工和抛光在内的多种表面处理方法来制备。 由此产生的次表面晶格无序将使用离子束通道、阴极发光和扫描电容显微镜进行评估。 在表面表征之后，将通过分子束外延在基板上生长外延膜，并将用于进行性能测试。 该项目将与 Eagle-Picher 研究实验室、洛斯阿拉莫斯国家实验室和国家标准与技术研究所合作进行。 该项目可以使人们对半导体基板超精细精加工中的次表面损伤有一个基本的了解，对 LED 和激光器等的生产具有显着的实际效益。 该项目的主要优势是与行业和政府实验室建立了牢固的合作伙伴关系。