6th International Symposium on Nondestructive Characterization of Materials, Oahu, Hawaii, June 7-11, 1993

第六届材料无损表征国际研讨会，夏威夷瓦胡岛，1993 年 6 月 7-11 日

• 批准号: 9224814
• 负责人: Robert Green
• 金额: $ 1.5万
• 依托单位: Johns Hopkins University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1993
• 资助国家: 美国
• 起止时间: 1993-05-01 至 1994-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9224814&HistoricalAwards=false
• 关键词: 6th; International; Symposium; Nondestructive; Characterization

This International Symposium on Nondestructive Characterization of Materials has been held in three different countries at intervals varying 3 to 1 years. This 6th symposium will be held in Oahu, Hawaii on June 7-11, 1993. It has an International Organizing Committee of 13 members from 5 countries. The complete program includes sessions on Electronic Component Nondestructive Characterization & Evaluation; Biomimetic and Biotic Materials; Interfaces; Nondestructive Characterization for Process Control; and Verification of Materials Processing Models. %%% This International Symposium on Nondestructive Characterization of Materials will be the sixth symposium, held in three different countries at time intervals varying from one to three years. It provides a forum for active scientists and engineers to exchange the recent advances in their respective fields. It is also a forum for the materials researchers and the nondestructive testing researchers to exchange information and to promote understandings.

本次材料无损表征国际研讨会已在三个不同的国家举行，间隔时间为 3 至 1 年。 第六届研讨会将于1993年6月7日至11日在夏威夷欧胡岛举行。它有一个由来自5个国家的13名成员组成的国际组委会。 完整的计划包括电子元件无损表征和评估课程；仿生和生物材料；接口；过程控制的无损表征；材料加工模型的验证。 %%% 本次材料无损表征国际研讨会将是第六次研讨会，在三个不同的国家举行，时间间隔从一到三年不等。 它为活跃的科学家和工程师提供了一个交流各自领域最新进展的论坛。 它也是材料研究人员和无损检测研究人员交流信息和促进理解的论坛。