A Low-Loss Substrate-Independent Approach for 60-GHz Transceiver Front-End Integration Using Micromachining Technologies

This paper presents a low-loss, substrate-independent approach to integrate transceiver front-ends for 60-GHz wireless applications. Dielectric loss is eliminated by using polymer and bulk silicon micromachining technologies to create a cavity-based duplexer and a horn antenna in the air, above the substrate. A coplanar waveguide input is used for easy integration of the low-noise amplifier and power amplifier of the receiver and transmitter, respectively, with the micromachined passive module. A prototype is designed, fabricated, and characterized, with the transmit band (TX) set between 58.7-59.5 GHz and the receive band (RX) as 60.6-61.4 GHz. The proposed method offers an easy integration of both planar components and 3-D integrated modules on top of the substrate.

本文提出了一种低损耗、与衬底无关的方法，用于集成60GHz无线应用的收发器前端。通过使用聚合物和体硅微加工技术在衬底上方的空气中创建一个基于腔体的双工器和一个喇叭天线，消除了介质损耗。采用共面波导输入，以便分别将接收器的低噪声放大器和发射器的功率放大器与微加工无源模块轻松集成。设计、制造并表征了一个原型，其发射频段（TX）设置在58.7 - 59.5GHz之间，接收频段（RX）为60.6 - 61.4GHz。所提出的方法能够在衬底顶部轻松集成平面元件和三维集成模块。