电子封装聚合物的热氧化行为及其对封装器件的影响

The thermal oxidation problem of electronic packaging polymers has become a major obstacle to electronic components for high temperature applications. There is an urgent need to understand the thermal oxidation behavior and the effect on the packaged devices. With a focus on this important need of automotive industry, the project will conduct study on the thermal oxidation mechanism and the effect on the electronic packages under high temperatures. Systematic experiments of thermal aging for Epoxy Molding Compound （EMC）will be performed. The microstructure and macroscopic properties of EMC under aging will be studied. The thermal oxidation mechanism will be analyzed at high temperature. Secondly, the mathematical model of thermal oxidation of EMC, the aging-dependent thermo-viscoelastic model and the model for aging-induced shrinkage will be established. The combination of the models will be implemented in a general Finite Element program. The numerical simulations based on multi-fields (thermal, mechanical stress, etc.) will be conducted. Numerical simulations will be carried out for real electronic packages and the effect of the thermal oxidation behavior on the package reliability will be analyzed. Finally, optimization on typical high temperature application electronic packages will be conducted. The research achievements will provide a theoretical base and technical support for the design and selection of packaging polymers, the package design, applications and the reliability assessment for high temperature electronics. Therefore, the project has both a scientific meaning and high application value.

电子封装聚合物的热氧化问题已成为电子元件高温应用的重要障碍，急需了解其热氧化行为及其对封装器件的影响。本项目针对汽车工业高温电子产品的重大需求，研究电子封装聚合物在高温条件下的热氧化机理及其对封装器件的影响。通过对环氧模塑料进行系统的热氧老化试验，研究环氧模塑料热氧化后的微观结构和宏观性能变化规律，揭示环氧模塑料的热氧化机理；建立环氧模塑料热氧化的数学模型、材料随热氧化程度演变的热粘弹性模型以及热氧化引起的体积收缩模型，并在通用有限元程序中实现，基于多场（热、机械应力等）仿真模型进行数值仿真分析；对电子封装器件的热氧化进行数值仿真，分析热氧化对封装器件的影响；在此基础上，对典型的高温应用电子封装进行优化设计。研究成果为电子封装聚合物的材料设计和选择、高温电子元件的封装设计和应用及可靠性评估提供理论依据和支撑，具有重要的科学意义和应用价值。

本项目针对汽车工业高温电子产品的重大需求，研究了电子封装聚合物在高温条件下的热氧化行为及其对封装器件的影响。通过对环氧模塑料进行系统的热氧老化试验，研究了环氧模塑料热氧化后的力学性能变化规律，揭示了环氧模塑料的热氧化机理和失效模式;建立了环氧模塑料热氧化的氧化扩散模型、材料氧化层力学性能的三维计算模型，并在通用有限元程序中实现，基于多场（热、机械应力等）仿真模型对电子封装器件的热氧化进行数值仿真，分析热氧化对封装器件的可靠性影响。研究成果为电子封装聚合物的材料设计和选择、高温电子元件的封装设计和应用及可靠性评估提供理论依据和支撑，具有重要的科学意义和应用价值。

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