Mechanical reliability and strain engineering of semiconducting 2D materials

半导体二维材料的机械可靠性和应变工程

• 批准号: 577601-2022
• 负责人: Filleter, TobinWTW
• 金额: $ 3.28万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Alliance Grants
• 财政年份: 2022
• 资助国家: 加拿大
• 起止时间: 2022-01-01 至 2023-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=759564
• 关键词: Mechanical; reliability; strain; engineering; semiconducting

Semiconducting two-dimensional (2D) materials are at the forefront of next-generation electronic materials development for applications in quantum transistors, flexible electronics, optoelectronics, and energy storage. These 2D materials offer atomic scale thicknesses allowing greater transistor density and extreme flexibility. However, while the mechanical properties of these 2D materials in their pristine forms are exceptional, the wide existence of defect of various types, densities, and configurations drastically reduces the mechanical properties in an elusive way. A quantitative characterization of the atomic structure-mechanical property relation of 2D materials can provide quantitative design guidelines for the stress-tolerant devices with a high-level confidence and thus is critical to the success of the device applications.This project is centered on the atomic structure and mechanical characterization, and the development of standards and best practices for the implementation of semiconducting 2D materials into electronic device design. A successful conclusion to this project will enable our industry partner Hitachi to translate the findings created by the project into standard characterization protocols, quantitative stress design requirements of 2D materials that will be central to next-generation device manufacturing systems. Not only will this enable the future of 2D material electronic device manufacturing in Canada, but this will position Hitachi as the world leader in enabling this design requirement and supplying of test systems for production facilities. Additionally, training of engineering students in the testing and operating of these fundamental technologies will enable knowledge translation that is crucial to developing Canadian expertise in 2D material device design.

半导体二维（2D）材料是下一代电子材料开发用于量子晶体管，柔性电子，光电子和能量存储的最前沿。这些2D材料提供了原子尺度的厚度，从而允许更高的晶体管密度和极端的柔韧性。但是，尽管这些2D材料以其原始形式的机械性能是例外的，但各种类型，密度和配置的缺陷的广泛存在会以难以捉摸的方式大大降低了机械性能。 2D材料的原子结构机械性能关系的定量表征可以为具有高级信心的耐压力耐受性设备提供定量设计指南，因此对于设备应用的成功至关重要。该项目集中在原子结构和机械表征上，以及用于实现半材料的标准和最佳练习，用于实现半材料2D材料。该项目的成功结论将使我们的行业合作伙伴日立将项目创建的发现转化为标准表征协议，2D材料的定量应力设计要求，这将是下一代设备制造系统中心的核心。这不仅可以使加拿大2D材料电子设备制造的未来成为未来，而且将日立定位为实现这项设计要求和生产设施测试系统的世界领导者。此外，对这些基本技术的测试和运营进行工程专业的培训将使知识翻译对于发展2D材料设备设计中的加拿大专业知识至关重要。