Compact and Energy Efficient Wireless Microelectromechanical Sensing Systems

紧凑且节能的无线微机电传感系统

• 批准号: RGPIN-2016-04871
• 负责人: Nabki, Frederic
• 金额: $ 2.26万
• 依托单位: École de technologie supérieure
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2020
• 资助国家: 加拿大
• 起止时间: 2020-01-01 至 2021-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=708927
• 关键词: Compact; Energy; Efficient; Wireless; Microelectromechanical

Like integrated circuits (ICs), microelectromechanical systems (MEMS) are a disruptive technology, enhancing systems and enabling new applications. The MEMS market is expanding at an increasing rate, projected to almost double from $11B in 2014 to $21B in 2020 [Yole, 2015]. Recently, MEMS sensors have had an increased presence, notably in wearables (e.g. smartwatches, fitness trackers) and sensor nodes (e.g. tracking, weather forecasting), where many sensors are combined. This warrants tighter integration to allow for more compact systems, and requires wireless interfaces to transmit sensor telemetry and allow for more mobility. Such sensors are suited to the upcoming Internet-of-Things, where large numbers of small and autonomous sensor nodes, independent of power and wiring infrastructure, are expected to be deployed with a much reduced deployment overhead. ICs can enable the circuitry required within such compact MEMS sensors. However, single-package integration with multiple MEMS remains difficult because of microfabrication process incompatibilities and specific design intricacies. Furthermore, energy efficiency is becoming a key challenge to system integration, as there is a strong push to deploy sensors into devices with smaller batteries, having insufficient energy capacity for the desired functionalities. Efficiency can be improved by reducing the power consumption of the wireless and interface electronics, and enhancing the sensor with energy harvesters. Accordingly, the vision of this research program is to integrate traditionally disjointed functions of sensing systems (i.e., transducer, sensing interface, wireless communication, and energy source) within a single package or, ultimately, a single die. Prof. Nabki will use his research expertise, recent progress and unique MEMS, ICs and integration technologies to attain this vision by pursuing 3 short term research objectives: i) elaborate MEMS transducers well-suited to above-IC integration and to transducer fusion; ii) investigate highly energy-efficient sensing interfaces and wireless communication ICs; and iii) explore hybrid mechanical energy harvesters to increase sensor energy efficiency. Ultimately, this research program will facilitate the creation of low-cost, small form factor wireless sensors that can be used in a variety of environments and applications, yielding advances in the fields of MEMS, energy harvesting, sensing, low-power ICs and integration, which represent significant contributions to research in Canada. These new sensors will have an overarching applicability and impact in sectors such as transportation, healthcare, environment and industrial processes, strengthening Canada's competitiveness. The 10 HQP trained during the research program (2 BEng, 3 MASc, 5 PhD) will gain valuable and marketable advanced manufacturing and design skills for the Canadian economy.

与集成电路 (IC) 一样，微机电系统 (MEMS) 是一项颠覆性技术，可增强系统并支持新应用。 MEMS 市场正在以越来越快的速度扩张，预计将从 2014 年的 11B 美元增长到 2020 年的 21B 美元，几乎翻倍[Yole，2015]。最近，MEMS 传感器的应用越来越多，特别是在可穿戴设备（例如智能手表、健身追踪器）和传感器节点（例如跟踪、天气预报）中，其中结合了许多传感器。这就需要更紧密的集成，以实现更紧凑的系统，并且需要无线接口来传输传感器遥测数据并实现更大的移动性。此类传感器适用于即将到来的物联网，其中大量独立于电源和布线基础设施的小型自主传感器节点预计将以大大减少的部署开销进行部署。 IC 可以实现此类紧凑型 MEMS 传感器所需的电路。然而，由于微加工工艺的不兼容性和特定设计的复杂性，单封装与多个 MEMS 的集成仍然很困难。此外，能源效率正在成为系统集成的一个关键挑战，因为人们大力推动将传感器部署到电池较小的设备中，而这些设备的能量容量不足以实现所需的功能。通过降低无线和接口电子设备的功耗以及通过能量收集器增强传感器可以提高效率。 因此，该研究计划的愿景是将传感系统（即传感器、传感接口、无线通信和能源）传统上脱节的功能集成到单个封装或最终的单个芯片中。 Nabki 教授将利用他的研究专业知识、最新进展以及独特的 MEMS、IC 和集成技术，通过追求 3 个短期研究目标来实现这一愿景：i) 精心设计非常适合 IC 之上集成和传感器融合的 MEMS 传感器； ii) 研究高能效传感接口和无线通信 IC； iii) 探索混合机械能量采集器以提高传感器能量效率。 最终，该研究计划将促进创建可用于各种环境和应用的低成本、小尺寸无线传感器，从而在 MEMS、能量收集、传感、低功耗 IC 和集成领域取得进展，这代表了对加拿大研究的重大贡献。这些新型传感器将在交通、医疗保健、环境和工业流程等领域具有全面的适用性和影响，从而增强加拿大的竞争力。在研究计划期间接受培训的 10 名 HQP（2 名工学士、3 名硕士、5 名博士）将为加拿大经济获得有价值且适销对路的先进制造和设计技能。