A scalable electromagnetic solver for interconnect networks in 3D integrated circuits

用于 3D 集成电路互连网络的可扩展电磁求解器

• 批准号: 524917-2018
• 负责人: Triverio, Piero
• 金额: $ 2.6万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2019
• 资助国家: 加拿大
• 起止时间: 2019-01-01 至 2020-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=686492
• 关键词: scalable; electromagnetic; solver; interconnect; networks

Three-dimensional integration holds great promise for enhancing the performance of integrated circuits, and isof significant interest to Advanced Micro Devices (Markham, ON), one of the leading manufacturers of graphicASICs (application-specific integrated circuits). The electromagnetic analysis of interconnect networks in 3Dintegrated circuits is, however, a formidable task. The goal of this proposal is to develop a scalable and parallelelectromagnetic solver that AMD can use to efficiently design 3D integrated circuits. The proposed researchwill contribute to the development of faster graphic cards and processors, helping Canada to strengthen itscompetitiveness in the microelectronics market.

三维集成具有增强集成电路性能的巨大希望，并且对先进的微型设备（Markham，On）的兴趣是图形学的领先制造商之一（特定于应用程序特定的集成电路）。但是，3D集成电路中互连网络的电磁分析是一项艰巨的任务。该提案的目的是开发可扩展的并行电磁求解器，AMD可以用来有效设计3D集成电路。拟议的研究将有助于开发更快的图形卡和处理器，从而帮助加拿大加强其在微电子市场中的竞争力。