A scalable electromagnetic solver for interconnect networks in 3D integrated circuits

用于 3D 集成电路互连网络的可扩展电磁求解器

• 批准号: 524917-2018
• 负责人: Triverio, Piero
• 金额: $ 2.6万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2019
• 资助国家: 加拿大
• 起止时间: 2019-01-01 至 2020-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=686492
• 关键词: scalable; electromagnetic; solver; interconnect; networks

Three-dimensional integration holds great promise for enhancing the performance of integrated circuits, and isof significant interest to Advanced Micro Devices (Markham, ON), one of the leading manufacturers of graphicASICs (application-specific integrated circuits). The electromagnetic analysis of interconnect networks in 3Dintegrated circuits is, however, a formidable task. The goal of this proposal is to develop a scalable and parallelelectromagnetic solver that AMD can use to efficiently design 3D integrated circuits. The proposed researchwill contribute to the development of faster graphic cards and processors, helping Canada to strengthen itscompetitiveness in the microelectronics market.

三维集成对于提高集成电路的性能有着巨大的前景，并且是图形ASIC（专用集成电路）领先制造商之一的Advanced Micro Devices（安大略省马克姆）非常感兴趣的技术。然而，3D 集成电路中互连网络的电磁分析是一项艰巨的任务。该提案的目标是开发一种可扩展的并行电磁求解器，AMD 可以使用它来高效地设计 3D 集成电路。拟议的研究将有助于开发更快的图形卡和处理器，帮助加拿大增强其在微电子市场的竞争力。