Ultra-Compact Low-Power Photonic Network-on-Chip

超紧凑低功耗光子片上网络

• 批准号: 418352-2012
• 负责人: Ménard, Michaël
• 金额: $ 1.6万
• 依托单位: Université du Québec à Montréal
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2018
• 资助国家: 加拿大
• 起止时间: 2018-01-01 至 2019-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=659550
• 关键词: Ultra; Compact; Low; Power; Photonic

As the computing capacity of microelectronic chips increases, thanks to continuous improvements in speed and transistor density, the flows of information they generate are becoming harder to handle. As a result, the electrical interconnections between chips and even between logical units within a chip are becoming bottlenecks. With aggregate bandwidths exceeding one Tb/s, optical networks have demonstrated the potential of light to transmit information, and now it can be used to resolve the challenges arising at the chip scale. Silicon photonics has demonstrated that optical devices can be manufactured using CMOS compatible processes but there are still numerous challenges that must be addressed to efficiently combine optical and electronic circuits on the same chip. For instance, the requirements on the silicon and buried oxide layers of silicon-on-insulator wafers differ greatly depending on whether they are used for optical or electronic applications.**This research program investigates a novel approach to integrated optics that could enable the creation of ultra-compact and low-power optical devices on top of electronic circuits. To achieve this, we will develop a fabrication process where silicon carbide (SiC) is used to form optical waveguides. SiC offers numerous advantages for on-chip optical circuits, including a high refractive index, the possibility of being deposited at low temperatures, and it can exhibit the electro-optic effect. Including optical components on CMOS dies represent a significant technological shift, and the knowledge developed during this research program will be valuable to Canadian electronics companies. Moreover, it will train 2 PhD and 3 M.Eng. students in the design and fabrication of advanced photonic circuits. The impact of integrated optical circuits based on SiC extends beyond on-chip optical telecommunications. The mechanical strength of SiC can be used to increase the resonant frequency of optomechanical cavities, and since graphene can be grown on SiC, SiC waveguides will be well suited to optically interconnect graphene electronics.****************************

由于速度和晶体管密度的不断提高，微电芯片的计算能力增加了，它们产生的信息流正在变得越来越难处理。 结果，芯片之间甚至芯片中逻辑单元之间的电气互连正在变成瓶颈。 随着总带宽超过一个TB/s，光网络已经证明了光传输信息的潜力，现在可以使用它来解决在芯片量表上产生的挑战。 硅光子学表明，可以使用CMOS兼容过程制造光学设备，但是仍然存在许多挑战，必须在同一芯片上有效地将光学电路和电子电路相结合。 例如，根据它们是用于光学或电子应用的硅硅晶体的硅和氧化物层的需求。电子电路顶部的超压缩和低功率光学设备。 为了实现这一目标，我们将开发一种制造过程，其中使用碳化硅（SIC）形成光学波导。 SIC为片上光学电路提供了许多优势，包括高折射率，在低温下沉积的可能性，并且可以表现出电形效应。 包括CMOS DIE上的光学组成部分包括一个重大的技术转变，在该研究计划期间开发的知识对于加拿大电子公司将很有价值。 此外，它将训练2博士学位和3 M.Eng。高级光子电路设计和制造的学生。 基于SIC的集成光电电路的影响扩展到片上光学电信。 SIC的机械强度可用于增加光力学腔的谐振频率，并且由于可以在SIC上生长石墨烯，因此SIC波导将非常适合于光学上互连的石墨烯电子产品。***************************************** **************