Design and optimization of heat dissipation and illumination patterns in novel recessed chip-on-board designs for high-power LED lighting applications

针对高功率 LED 照明应用的新型嵌入式芯片级设计中的散热和照明模式的设计和优化

基本信息

批准号：
521640-2017
负责人：
Pisana, Simone
金额：
$ 1.82万
依托单位：
York University
依托单位国家：
加拿大
项目类别：
Engage Grants Program
财政年份：
2017
资助国家：
加拿大
起止时间：
2017-01-01 至 2018-12-31
项目状态：
已结题

来源：
https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=640075
关键词：
Design optimization heat dissipation illumination

项目摘要

Thermal management is a fundamental limiting factor in solid state lighting applications, affecting the devicereliability and luminous efficacy. In high-power applications, the increased chip density exacerbates the needfor efficient heat dissipation pathways. Chip-on-board (COB) approaches improved the state of the art byremoving the need to individually package LED chips, while yielding better cooling efficiencies by providing amore intimate thermal contact between the chip and heat sink. However, in COB LED products the flat boarddesign limits the heat spreading that can take place at the interface with heat sinks. A recessed heat sinkcarrying the COB is proposed as an approach to improve the heat spread within the heat sink, and therebyimprove the cooling efficiency of the COB assembly. While the idea is attractive, the design trade-offs in termsof cooling capabilities, recess depth & shape and their impact on the luminous intensity spatial distribution areunknown. Additionally, the recessed heat sink material and relative placement of the phosphor may have anadverse effect on the color output of the light fixture. Systematic studies of heat sink-recessed COB designs canyield insights into these trade-offs and optimum operating points. The research can improve the adoption ofhigh-power solid state lighting in industrial applications, with tremendous environmental benefits, as theincrease in light output per watt consumed greatly reduces energy waste and green-house gas emission fromnon-renewable energy sources.

热管理是固态照明应用中的一个基本限制因素，影响了偏置性和发光功效。在高功率应用中，增加的芯片密度加剧了有效的热量耗散途径。 Chip-on-Board（COB）方法改善了最新的状态，即需要单独包装LED芯片，同时通过提供芯片和散热器之间的Amore亲密热接触，从而产生更好的冷却效率。但是，在COB LED产品中，Flat BoardSign限制了可以在散热器接口处进行的热量扩散。提出了嵌入式散热器的库布作为改善散热器内的热量扩散的方法，从而使COB组件的冷却效率提高。虽然这个想法很有吸引力，但以冷却能力，凹陷深度和形状及其对发光强度空间分布的影响的设计权衡是否定的。此外，凹入的散热器材料和磷光器的相对位置可能会对灯具的颜色输出产生不利影响。对散热器不必要的COB设计的系统研究对这些权衡和最佳操作点的峡谷洞察力。这项研究可以改善工业应用中高功率固态照明的采用，并具有巨大的环境利益，因为每瓦的光输出的发射大大减少了能源浪费和绿色房屋气体的排放，而绿色的气体排放量会从诺顿可再生能源来源。