Modelling of environmental effects on silicon dangling bond quantum cellular automata circuits and development of simulation tools

环境对硅悬键量子细胞自动机电路影响的建模和仿真工具的开发

• 批准号: 478777-2015
• 负责人: Walus, Konrad
• 金额: $ 1.82万
• 依托单位: University of British Columbia
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2015
• 资助国家: 加拿大
• 起止时间: 2015-01-01 至 2016-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=579771
• 关键词: Modelling; environmental; effects; silicon; dangling

Founded in 2011 and located in Edmonton Canada, Quantum Silicon Inc. (QSI) is the world's first commercial developer of quantum-dot computing devices based on silicon dangling bond technology. These devices operate at an atomic scale without the conventional current consumption of CMOS-based electronics, thereby offering advantages of higher speed and lower power consumptions than industry standard computing devices. Different methods of employing quantum dots to extend computational abilities beyond the limits imposed by CMOS fabrication processes have been refined over the past 2 decades, but QSI's technology is unique in that it employs silicon dangling bonds on a H-Si(001) surface to act as the quantum dots. In so doing, precise assemblies of such dots can be created to form complex circuits that perform binary functions by employing the well known quantum dot cellular automata (QCA) computing scheme. To date, extensive research has gone into designing a wide variety of QCA circuits without a suitable means of fabrication. QSI's technology therefore offers all new potential to realize QCA circuits and take practical advantage of circuit design CAD tools that have already been developed. In light of this situation, modification and taylorization of current QCA CAD tools to simulating circuits based on QSI's dangling bond technology is important for purposes of designing and debugging. At the moment, methods of simulating QCA circuit behaviour rarely account for the effects of the environment (decoherence) on circuit operation imposed by a specific physical implementation, but instead tend to make rough approximations of generic thermal effects or ignore them all together. Therefore, in the case of silicon dangling bond technology, there is no existing analysis of how thermal interaction between silicon dangling bond quantum dots and their silicon lattice substrate influences circuit performance. This project aims to develop these models and incorporate them into the CAD tool QCADesigner allowing QSI engineers to better understand the circuit level behavior.

Quantum Silicon Inc.（QSI）成立于2011年，位于加拿大埃德蒙顿（Edmonton），是世界上第一个广告 基于硅悬挂键技术的量子点计算设备的开发人员。这些设备 以原子量的规模运行，而没有常规的基于CMO的电子产品的当前消耗 与行业标准计算设备相比，提供更高速度和低功耗的优势。 采用量子点来扩展计算能力的不同方法超出了由 在过去的20年中，CMOS制造过程已经完善了，但是QSI的技术是独一无二的 在H-SI（001）表面上使用硅悬挂键充当量子点。这样做，精确 可以创建此类点的组件，以形成复杂的电路，通过采用使用 众所周知的量子点细胞自动机（QCA）计算方案。迄今为止，广泛的研究已经消失 设计各种QCA电路，而没有合适的制造方式。 QSI的技术 因此，提供了实现QCA电路并利用电路设计CAD的实际优势的所有新潜力 已经开发的工具。 鉴于这种情况，当前QCA CAD工具的修改和taylorization以模拟电路基于电路 在QSI的悬挂式债券上，技术对于设计和调试的目的很重要。眼下， 模拟QCA电路行为的方法很少解释环境的影响（脱碳） 在特定物理实施中实施的电路操作，但往往会变得粗糙 通用热效应的近似或将它们忽略在一起。因此，在硅的情况下 悬挂债券技术，没有现有的分析硅之间的热相互作用 键量点及其硅晶格底物会影响电路性能。这个项目旨在 开发这些模型，并将它们纳入CAD工具qcadesigner，从而使QSI工程师更好 了解电路级别的行为。