Modelling of environmental effects on silicon dangling bond quantum cellular automata circuits and development of simulation tools

环境对硅悬键量子细胞自动机电路影响的建模和仿真工具的开发

• 批准号: 478777-2015
• 负责人: Walus, Konrad
• 金额: $ 1.82万
• 依托单位: University of British Columbia
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2015
• 资助国家: 加拿大
• 起止时间: 2015-01-01 至 2016-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=579771
• 关键词: Modelling; environmental; effects; silicon; dangling

Founded in 2011 and located in Edmonton Canada, Quantum Silicon Inc. (QSI) is the world's first commercial developer of quantum-dot computing devices based on silicon dangling bond technology. These devices operate at an atomic scale without the conventional current consumption of CMOS-based electronics, thereby offering advantages of higher speed and lower power consumptions than industry standard computing devices. Different methods of employing quantum dots to extend computational abilities beyond the limits imposed by CMOS fabrication processes have been refined over the past 2 decades, but QSI's technology is unique in that it employs silicon dangling bonds on a H-Si(001) surface to act as the quantum dots. In so doing, precise assemblies of such dots can be created to form complex circuits that perform binary functions by employing the well known quantum dot cellular automata (QCA) computing scheme. To date, extensive research has gone into designing a wide variety of QCA circuits without a suitable means of fabrication. QSI's technology therefore offers all new potential to realize QCA circuits and take practical advantage of circuit design CAD tools that have already been developed. In light of this situation, modification and taylorization of current QCA CAD tools to simulating circuits based on QSI's dangling bond technology is important for purposes of designing and debugging. At the moment, methods of simulating QCA circuit behaviour rarely account for the effects of the environment (decoherence) on circuit operation imposed by a specific physical implementation, but instead tend to make rough approximations of generic thermal effects or ignore them all together. Therefore, in the case of silicon dangling bond technology, there is no existing analysis of how thermal interaction between silicon dangling bond quantum dots and their silicon lattice substrate influences circuit performance. This project aims to develop these models and incorporate them into the CAD tool QCADesigner allowing QSI engineers to better understand the circuit level behavior.

Quantum Silicon Inc. (QSI) 成立于 2011 年，位于加拿大埃德蒙顿，是世界上第一家商业化 基于硅悬键技术的量子点计算设备的开发商。这些设备 在原子尺度上运行，没有基于 CMOS 的电子器件的传统电流消耗，从而 与行业标准计算设备相比，具有速度更快、功耗更低的优势。 使用量子点的不同方法将计算能力扩展到超出量子点施加的限制 CMOS 制造工艺在过去 20 年中不断完善，但 QSI 的技术的独特之处在于它 采用 H-Si(001) 表面上的硅悬键作为量子点。这样做，精确 可以创建这些点的集合来形成复杂的电路，通过使用执行二进制功能 众所周知的量子点元胞自动机（QCA）计算方案。迄今为止，广泛的研究已经 在没有合适的制造方法的情况下设计各种 QCA 电路。 QSI的技术 因此，为实现 QCA 电路和充分利用电路设计 CAD 提供了全新的潜力 已经开发出来的工具。 针对这种情况，对现有的QCA CAD工具进行了修改和泰勒化，以基于仿真电路 QSI 的悬空键技术对于设计和调试非常重要。眼下， 模拟 QCA 电路行为的方法很少考虑环境的影响（退相干） 取决于特定物理实现所施加的电路操作，但往往会变得粗糙 一般热效应的近似值或将它们全部忽略。因此，对于硅 悬空键技术，目前还没有分析硅悬空键之间如何热相互作用 键合量子点及其硅晶格基板影响电路性能。该项目旨在 开发这些模型并将其合并到 CAD 工具 QCADesigner 中，使 QSI 工程师能够更好地 了解电路级行为。