Low-Cost Hermetic Packaging for Implantable electronics

用于植入式电子产品的低成本气密包装

• 批准号: 6693605
• 负责人: BRIAN P FARRELL
• 金额: $ 10.08万
• 依托单位: FOSTER-MILLER, INC.
• 依托单位国家: 美国
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-09-15 至 2005-06-30
• 项目状态: 已结题
• 来源: https://reporter.nih.gov/project-details/6693605
• 关键词: biomaterial development /preparation; biomaterial evaluation; biomaterial interface interaction; biomedical equipment development; electrical property; implant; nervous system prosthesis; optics; packaging material; polymers; telemetry

DESCRIPTION (provided by applicant): While implantable electronic systems continue to show tremendous promise, major deficiencies remain in the area of packaging and interconnection. Foster-Miller, in this proposed effort, will develop and demonstrate a new, low-cost, highly reliable, hermetic packaging technology for implantable electronics. This new packaging platform is based on remarkable new class of materials known as thermoplastic Liquid Crystal Polymers (LCPs). Foster-Miller has been developing an electronic packaging technology based on these innovative LCPs for a host of electronic and optoelectronic applications. More recently, Foster-Miller has been applying their LCP film technology to the biomedical world, in particular in the area of neural prostheses. Foster-Miller is currently funded by NINDS to develop LCPbased microribbon cables as a direct replacement for existing silicon and polyimide cables. This work has shown great early promise with the LCP materials proving both extremely insulative (electrically) and biologically inert. This proposed effort builds on this early promise to expand the technology to address the packaging of implanted electronics. In addition to their excellent electrical properties, LCPs have barrier properties comparable to glass, several orders of magnitude greater than most other polymers, thus offering the potential of a plastic hermetic packaging technology, a hitherto unimaginable concept.

描述（由申请人提供）： 尽管可植入的电子系统继续表现出巨大的希望，但包装和互连领域仍然存在主要缺陷。在这项拟议的工作中，Foster-Miller将开发并展示一种新的，低成本，高度可靠的密封包装技术，用于可植入的电子产品。这个新的包装平台基于出色的新型材料，称为热塑性液晶聚合物（LCP）。 Foster-Miller一直在基于这些创新的LCP开发电子包装技术，用于许多电子和光电应用。最近，Foster-Miller一直将其LCP电影技术应用于生物医学世界，尤其是在神经假体领域。 Foster-Miller目前由NINDS资助，用于开发基于LCPB的微孔电缆，以直接替换现有的硅和聚酰亚胺电缆。这项工作表现出了巨大的早期希望，而LCP材料证明了极其绝缘（电）和生物学上的惰性。这项拟议的努力是基于扩大技术以解决植入电子产品的早期承诺的基础。除了其出色的电气性能外，LCP还具有与玻璃相当的屏障特性，比大多数其他聚合物大的几个数量级，因此提供了塑料密封包装技术的潜力，这是一种迄今难以想象的概念。