HI-IMPERATIVE (Highly Innovative Thermally Conductive Materials for Power-Electronics Applications in EV)

HI-IMPERATIVE（用于电动汽车电力电子应用的高度创新导热材料）

• 批准号: 10004716
• 金额: $ 49.06万
• 依托单位: DYCOTEC MATERIALS LTD
• 依托单位国家: 英国
• 项目类别: Collaborative R&D
• 财政年份: 2021
• 资助国家: 英国
• 起止时间: 2021 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=10004716
• 关键词: HI; IMPERATIVE; Highly; Innovative; Thermally

Vehicle electrification is driving a revolution in power-electronics, where higher power densities are creating the **need** for enhanced thermal management in combination with higher operating voltages necessitating superior electrical insulation.**Project vision** is to address the power-electronics challenge by developing, low-cost **Thermal Interface Materials (TIMs) with thermal conductivity, ?\>10W/mK and operating temperatures up to 175°C, whilst being electrically insulative**. Three high-? TIMs have been identified, representing the full range of properties and process approaches required for each critical interface.**Key Objectives:**1\. To develop novel TIM materials2\. To develop thermoset TIMs:a. **"3D-fill" TIM, ?\>3W/mK**, that can be applied to chips using vacuum dispersion or transfer moulding at room temperature for void-free filling of 50µm gaps.b. **TIM sheet, ?\>10W/mK.**c. **Conformable Beta-stage Pre-Preg TIM, ?\>10W/mK** applied as partially cured film to be laminated using standard PCB processes.3\. To implement TIMs to current MTCL "Standard" Direct bonded copper (DBC) power MOSFET module chip design (that will form the basis of MTCL's future power modules) to achieve temperature rise =0.1°C/W and maximum Tj=175°C.**The focus areas** are in new and existing power-electronics for EVs, with secondary markets in rapidly growing markets in zero-carbon, renewable energy markets as a part of smart grid power distribution, with further applications in high-speed data technologies, such as 5G.HI-IMPERATIVE is a **game-changing** approach to develop thermoset nanocomposites that will lead to commercial implementation of high performance TIMs. HI-IMPERATIVE is **significantly ahead of other ceramic and polymer based TIMs, in terms of technical performance (very high thermal conductivity and operating temperature whilst being electrically insulative) and optimised flow properties** that will enable application of low-cost TIMs to achieve effective thermal control for the first time, opening up global market opportunities for high-power-electronic components for EVs.HI-IMPERATIVE has 3 partners:* **Dycotec Materials Limited (DML):** SME that will manufacture and commercialise hybrid hBN/BNNT-thermoset nanocomposites;* **Microchip Technology Caldicot Ltd (MTCL)**: Part of Microchip Technology Incorporated, a global power-electronics OEM ($5.27(£3.87)Bn revenue 2020), that will apply solution to commercial power-electronics systems;* **The University of Manchester (UoM)**, a world-class materials research institute, that will help develop and characterise the materials.

车辆的电力正在推动电力电力的革命，在这种革命中，更高的功率密度正在创造**需要**，以增强导热管理，并结合更高的运行电压，必要的超级电子绝缘。电绝缘**。三个高？已经确定了TIM，代表了每个关键接口所需的全部属性和过程方法。**关键目标：** 1 \。开发新颖的tim材料2 \。开发热固性蒂姆斯： **“ 3D填充” Tim，？\> 3W/MK **，可以使用真空分散剂或在室温下传输成型用于芯片，以无效填充50µm的间隙。 ** tim Sheet，？\> 10W/mk。** c。 **可符合的beta阶段预先序列tim，？\> 10W/mk **作为部分固化的膜应用，以使用标准的PCB过程层压3 \。实施TIMS到当前MTCL“标准”直接粘合铜（DBC）功率MOSFET模块芯片设计（这将构成MTCL未来功率模块的基础），以实现温度升高= 0.1°C/W，最大TJ = 175°C。作为智能电网电源分配的一部分，在高速数据技术中的进一步应用，例如5G.Hi-imprativative是一种改变游戏规则的**方法，用于开发热固性纳米复合材料，可导致高性能TIM的商业实施。在技​​术性能（非常高的导热率和工作温度非常高，同时具有电子隔热性）和优化的流量性能上，高功能与其他基于陶瓷和聚合物的TIM相比明显领先于**，这将使低成本的TIM能够应用低成本的TIM，以在第一次实现有效的热控制范围，为全球范围内的材料提供了高度竞争力的全球范围：有限（DML）：** SME将使低成本的TIMS首次实现有效的热控制，为Evs.hi-imprative的高功率电子组件打开了全球市场机会：** ** Dycotec Materials Limited（DML）：** SME将制造和商业化hybrid hbn/bebn/bnnt nnnt nnnt nnt n. **; Technology Caldicot Ltd（MTCL）**：Microchip Technology Incorporated的一部分是全球电力电机OEM（$ 5.27（£3.87）BN收入2020年），将解决方案应用于商业电力电子系统；