HI-IMPERATIVE (Highly Innovative Thermally Conductive Materials for Power-Electronics Applications in EV)

HI-IMPERATIVE（用于电动汽车电力电子应用的高度创新导热材料）

• 批准号: 10004716
• 金额: $ 49.06万
• 依托单位: DYCOTEC MATERIALS LTD
• 依托单位国家: 英国
• 项目类别: Collaborative R&D
• 财政年份: 2021
• 资助国家: 英国
• 起止时间: 2021 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=10004716
• 关键词: HI; IMPERATIVE; Highly; Innovative; Thermally

Vehicle electrification is driving a revolution in power-electronics, where higher power densities are creating the **need** for enhanced thermal management in combination with higher operating voltages necessitating superior electrical insulation.**Project vision** is to address the power-electronics challenge by developing, low-cost **Thermal Interface Materials (TIMs) with thermal conductivity, ?\>10W/mK and operating temperatures up to 175°C, whilst being electrically insulative**. Three high-? TIMs have been identified, representing the full range of properties and process approaches required for each critical interface.**Key Objectives:**1\. To develop novel TIM materials2\. To develop thermoset TIMs:a. **"3D-fill" TIM, ?\>3W/mK**, that can be applied to chips using vacuum dispersion or transfer moulding at room temperature for void-free filling of 50µm gaps.b. **TIM sheet, ?\>10W/mK.**c. **Conformable Beta-stage Pre-Preg TIM, ?\>10W/mK** applied as partially cured film to be laminated using standard PCB processes.3\. To implement TIMs to current MTCL "Standard" Direct bonded copper (DBC) power MOSFET module chip design (that will form the basis of MTCL's future power modules) to achieve temperature rise =0.1°C/W and maximum Tj=175°C.**The focus areas** are in new and existing power-electronics for EVs, with secondary markets in rapidly growing markets in zero-carbon, renewable energy markets as a part of smart grid power distribution, with further applications in high-speed data technologies, such as 5G.HI-IMPERATIVE is a **game-changing** approach to develop thermoset nanocomposites that will lead to commercial implementation of high performance TIMs. HI-IMPERATIVE is **significantly ahead of other ceramic and polymer based TIMs, in terms of technical performance (very high thermal conductivity and operating temperature whilst being electrically insulative) and optimised flow properties** that will enable application of low-cost TIMs to achieve effective thermal control for the first time, opening up global market opportunities for high-power-electronic components for EVs.HI-IMPERATIVE has 3 partners:* **Dycotec Materials Limited (DML):** SME that will manufacture and commercialise hybrid hBN/BNNT-thermoset nanocomposites;* **Microchip Technology Caldicot Ltd (MTCL)**: Part of Microchip Technology Incorporated, a global power-electronics OEM ($5.27(£3.87)Bn revenue 2020), that will apply solution to commercial power-electronics systems;* **The University of Manchester (UoM)**, a world-class materials research institute, that will help develop and characterise the materials.

汽车电气化正在推动电力电子领域的一场革命，其中更高的功率密度正在创造对增强热管理的**需求**，同时需要更高的工作电压，从而需要卓越的电气绝缘性。**项目愿景**是解决电力-通过开发低成本**热界面材料 (TIM) 来应对电子领域的挑战，其导热系数为 ?\>10W/mK，工作温度高达 175°C，同时具有电气特性已确定了三种高-TIM 材料，代表了每个关键界面所需的全部性能和工艺方法。**主要目标：**1\. 开发新型 TIM 材料2\。 a. **“3D 填充”TIM，？\>3W/mK**，可在室温下使用真空分散或传递成型应用于芯片，以实现 50μm 间隙的无空隙填充。 **TIM 片材，?\>10W/mK。**c. **适形 Beta 级预浸料 TIM，?\>10W/mK** 作为部分固化薄膜使用标准 PCB 工艺进行层压。3\将 TIM 应用于当前 MTCL“标准”直接键合铜 (DBC) 功率 MOSFET 模块芯片设计（这将构成 MTCL 未来功率模块的基础），以实现温升。 =0.1°C/W，最大 Tj=175°C。**重点领域**是电动汽车的新型和现有电力电子器件，其中二级市场是快速增长的零碳市场、可再生能源市场智能电网配电的应用，以及在高速数据技术（例如 5G）中的进一步应用。HI-IMPERATIVE 是一种开发热固性纳米复合材料的“改变游戏规则”的方法，将导致高性能 TIM 的商业实施。 HI-IMPERATIVE 在技术性能（非常高的导热性和工作温度，同时具有电绝缘性）和优化的流动特性方面**显着领先于其他基于陶瓷和聚合物的 TIM，这将使低成本 TIM 能够应用于首次实现有效的热控制，为电动汽车大功率电子元件开辟全球市场机会。HI-IMPERATIVE 拥有 3 个合作伙伴：* **Dycotec Materials Limited (DML)：** 将制造和商业化混合六方氮化硼/BNNT-热固性纳米复合材料的中小企业；* **Microchip Technology Caldicot Ltd (MTCL)**：全球电力电子 OEM 制造商 Microchip Technology Incorporated 的一部分（5.27 美元（3.87 英镑） ) ) 2020 年收入达 10 亿美元），该解决方案将应用于商业电力电子系统；* **曼彻斯特大学 (UoM)**，世界一流的材料研究所，将帮助开发和表征材料。