Epitaxial Growth of High Quality SiC by Sublimation Close Space Technique with High Growtn Rate

高生长率升华近距离技术外延生长高质量SiC

基本信息

  • 批准号:
    09450011
  • 负责人:
  • 金额:
    $ 8.83万
  • 依托单位:
  • 依托单位国家:
    日本
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
  • 财政年份:
    1997
  • 资助国家:
    日本
  • 起止时间:
    1997 至 1998
  • 项目状态:
    已结题

项目摘要

In CST method, growth is promoted by sublimation and diffusion transfer in a narrow space which is constructed by source, substrate and graphite spacer. This method is basically same as conventional sublimation method for SiC-bulk. One big difference of configuration is the distance between source and substrate. We used 3C-SiC polycrystalline plate with high purity as source and High growth was achieved at a temperature range of 2200-2400゚C, and it was around 40-200 mu m/h. Activation energy obtained by temperature dependence of the growth rate was l47kcal/mol. By introducing off-angle to the substrate, a mirror-like morphology was obtained in the wide temperature range. Step bunching was also observed and trace width of the step was about 5 mu m. A defect having line shaped shadow was observed along <1120> direction, and it indicates that crystal growth followed step-flow mechanism. Surface morphology is often affected by many parameters such as spacer height. When the spacer height decreased, wavy pattern appeared. When the height increased, rather smooth surface appeared. Ta-sheet was also used to avoid unwanted carbon species from the wall of crucible. Appropriate condition, very smooth surface was obtained, however, carbonization of Ta seems a key parameter to get high quality SiC epilayer. Epilayer made in Ta pasted crucible, step-bunching free surface was obtained. Donor-acceptor pair emission was greatly suppressed in the photoluminescense measurement In this photoluminescence, RO and So lines, which is related excitons bound to neutral N donors, were observed. It means epitaxial layers are of high quality. These lines were especially observed epitaxial layers with high growth rate such as more than 100 mu m/h. It indicates that increasing growth rate may be useful to decrease impurity density doped into epitaxial layers. We made Schottky diodes showed breakdown voltage of 40V without edge termination.
在CST方法中,通过sus缩的sublimation促进了生长,而狭窄的空间中的扩散转移与SIC-Bulk的常规亚属性方法基本相同在2200-2400 c的温度范围内,使用的3C-SIC多晶板和高生长均为酸痛,并且通过温度依赖的生长速率获得的激活能量约为40-200 m/h。在底物中,也观察到了巨大的温度,并且在较宽的温度下获得了镜像。阶跃机制通常受到许多参数的影响,例如隔离度的高度,当高度增加时,ta片也会从坩埚中获得不需要的碳种类。然而,在粘贴钉钉中,碳化是一种关键参数。观察到的n供体意味着外延层的质量很高二极管显示带边缘终止的40V击穿电压。

项目成果

期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
K.Matsumoto: "6H-SiC Schottky diode edge terminated using amorphous SiC by sputtering method" Proceedings of ICSCIII-N97,Trans Tech Publications. 925-928 (1997)
K.Matsumoto:“通过溅射方法使用非晶 SiC 进行边缘端接的 6H-SiC 肖特基二极管”ICSCIII-N97 论文集,Trans Tech Publications。
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    0
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  • 通讯作者:
T.Yoshida S.K.Lilov and S.Nishino: "Epitaxy of high quality SiC layers by CST" Proceedings of ICSCIII-N97, Trans Tech Publications. 155-158 (1997)
T.Yoshida S.K.Lilov 和 S.Nishino:“CST 的高质量 SiC 层外延”ICSCIII-N97 论文集,Trans Tech Publications。
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    0
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  • 通讯作者:
S.Nishino, K.Matsumoto, T.Yoshida, Y.Chen and S.K.Lilov: "Epitaxial Growth of 4H-SiC by Sublimation Close Space Technique" Abtract of 2nd European Conference on SiC and Related Materials, Montpellier, France. 27-28 (1998)
S.Nishino、K.Matsumoto、T.Yoshida、Y.Chen 和 S.K.Lilov:“通过升华近距离技术外延生长 4H-SiC”第二届欧洲 SiC 及相关材料会议摘要,法国蒙彼利埃。
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    0
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S.Nishino, T.Miyanagi and Y.Nishio: "Epitaxial growth of SiC on alpha-SiC using Si2C16+C3H8+H2 system" Proceedings of ICSCIII-N97, Trans Tech Publications. 155-158 (1997)
S.Nishino、T.Miyanagi 和 Y.Nishio:“使用 Si2C16 C3H8 H2 系统在 α-SiC 上外延生长 SiC”ICSCIII-N97 论文集,Trans Tech Publications。
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    0
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S.Nishino: "Epitaxial Growth of High Quality SiC by Sublimation Close Space Technique" Mat.Res.Soc.Symp.Proc.vol.483. 483. 30 -3 (1998)
S.Nishino:“通过升华近距离技术外延生长高质量 SiC”Mat.Res.Soc.Symp.Proc.vol.483。
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    0
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NISHINO Shigehiro其他文献

NISHINO Shigehiro的其他文献

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{{ truncateString('NISHINO Shigehiro', 18)}}的其他基金

Crystal Growth of Free Standing 3C-SiC Using Air-Bridge Structure
使用气桥结构的独立式 3C-SiC 晶体生长
  • 批准号:
    15360010
  • 财政年份:
    2003
  • 资助金额:
    $ 8.83万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Crystal growth of 3C-SiC on Si substrates by channel epitaxy method
沟道外延法在硅衬底上生长3C-SiC晶体
  • 批准号:
    13450012
  • 财政年份:
    2001
  • 资助金额:
    $ 8.83万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Low Temperature Growth of Semiconductor Sic by Photo-Plasma Double Excitation
光等离子体双激发低温生长半导体SiC
  • 批准号:
    01550016
  • 财政年份:
    1989
  • 资助金额:
    $ 8.83万
  • 项目类别:
    Grant-in-Aid for General Scientific Research (C)

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