3D printer for Additively Manufactured Electronics

用于增材制造电子产品的 3D 打印机

• 批准号: 539303076
• 金额: --
• 依托单位: Albert-Ludwigs-Universität Freiburg
• 依托单位国家: 德国
• 项目类别: Major Research Instrumentation
• 财政年份: 2024
• 资助国家: 德国
• 起止时间: 2023-12-31 至 无数据
• 项目状态: 未结题
• 来源: https://gepris.dfg.de/gepris/projekt/539303076?language=en
• 关键词: 3D; printer; Additively; Manufactured; Electronics

Digitalization, Artificial Intelligence, and Industry 4.0 are key areas in which the manufacturing process "Additively Manufacturing Electronics" (AME) plays a significant role. The integration of electronics into components allows for the development of intelligent sensors and connected systems with increased efficiency and productivity. AME enables rapid prototyping and product development, allowing research institutions and companies to optimize their innovation processes. The tailored solutions and design freedom of AME support adaptation to the specific requirements of these forward-looking areas. By acquiring a 3D AME printer, the Laboratory for Microelectronics at the University of Freiburg is enabled to transform its self-developed and manufactured application-specific integrated circuits (ASICs) into complex systems using state-of-the-art manufacturing processes. The requested 3D AME printer will enable the co-integrated printing of dielectrics and metals, using inkjet technology to combine UV-cured dielectric materials with IR-sintered silver nanoparticles to create high-resolution electrical structures. Such co-integrated printing in arbitrary three-dimensional geometries allows for the electrical contacting of the manufactured ASICs in an innovative way while simultaneously protecting them from external influences. Instead of the typically planar combination of electrical components in common printed circuit board (PCB) assembly, stacked, orthogonal, or even spherical arrangements of individual components are possible, resulting in significantly smaller form factors. The printing process and low manufacturing temperature allow for pausing the printing and thus the package-free embedding of ASICs as so-called Bare Dies, minimizing the form factor and improving signal qualities due to the elimination of bond wires and shorter traces. Furthermore, the routing of conductors can be revolutionized by shielding them entirely within the 3D-printed enclosure, twisting them in larger groups, or finely tuning their impedances. The production of passive electrical components and 3D antennas is also possible, ultimately achieving a fusion of PCBs, passive components, and ASICs into a highly integrated microelectronic unit. In the end, a 3D AME printer reduces the need for external manufacturing and expands the capabilities of the Faculty of Engineering to manufacture multiphysical microsystems. Research on multiphysical sensing and highly integrated brain-machine interfaces is being promoted. In education, the printer enables practical experience with parasitic ASIC effects and their impact on sensitive circuits.

数字化、人工智能和工业 4.0 是“增材制造电子”(AME) 制造工艺发挥重要作用的关键领域。将电子器件集成到组件中可以开发智能传感器和连接系统，从而提高效率和生产力。 AME 支持快速原型设计和产品开发，使研究机构和公司能够优化其创新流程。 AME 的定制解决方案和设计自由度支持适应这些前瞻性领域的具体要求。通过购买 3D AME 打印机，弗莱堡大学微电子实验室能够使用最先进的制造工艺将其自行开发和制造的专用集成电路 (ASIC) 转变为复杂的系统。所要求的 3D AME 打印机将能够实现电介质和金属的协同集成打印，使用喷墨技术将 UV 固化电介质材料与 IR 烧结银纳米颗粒相结合，以创建高分辨率的电气结构。这种任意三维几何形状的共集成印刷允许以创新的方式对制造的 ASIC 进行电接触，同时保护它们免受外部影响。与常见印刷电路板 (PCB) 组件中电气元件的典型平面组合不同，各个元件可以堆叠、正交甚至球形排列，从而显着减小外形尺寸。印刷工艺和低制造温度允许暂停印刷，从而实现 ASIC 的无封装嵌入，即所谓的裸芯片，由于消除了键合线和更短的走线，从而最大限度地减少了外形尺寸并提高了信号质量。此外，可以通过将导体完全屏蔽在 3D 打印外壳内、将其扭曲成更大的组或微调其阻抗来彻底改变导体的布线。无源电气元件和3D天线的生产也是可能的，最终实现PCB、无源元件和ASIC融合成高度集成的微电子单元。最终，3D AME 打印机减少了对外部制造的需求，并扩展了工程学院制造多物理微系统的能力。多物理传感和高度集成的脑机接口研究正在推进。在教育领域，打印机可以让人们获得寄生 ASIC 效应及其对敏感电路影响的实际经验。